Modular Motherboard for a Computer System and Method Thereof

2. The motherboard of claim 1, wherein the second printed circuit board assembly further includes at least one of a system logic integrated circuit, a management controller and a high speed peripheral device interface mounted thereon.

6. The motherboard of claim 5, wherein the first high speed data connector is positioned adjacent to the first central processing unit and away from the second processing unit; and wherein the third high speed connector is positioned adjacent to the second central processing unit and away from the first central processing unit.

7. The motherboard of claim 6, wherein the first high speed data connector is coupled to only the first central processing unit, and the third high speed connector is coupled to only the second central processing unit.

8. The motherboard of claim 4, wherein the first high speed data connector is positioned between the first and second central processing units.

9. The motherboard of claim 4, wherein the first high speed data connector carries signals between the first and second central processing units and the second printed circuit board assembly.

11. The method of claim 10, wherein the second printed circuit board assembly includes at least one of a system logic integrated circuit and a management controller integrated thereon.

12. The method of claim 10, wherein a boot device is removably attached to the second printed circuit board assembly.

16. The computer motherboard of claim 15, wherein routing of a signal path from the one or more central processing units to the input/output interface and/or the high-speed peripheral device interface is reduced.

18. The computer motherboard assembly of claim 17, wherein the high speed peripheral device interface comprises at least two connectors.

19. The computer motherboard assembly of claim 17, wherein the third printed circuit board assembly is adapted to connect to a first boot device for the first circuit board assembly and a second boot device for the second circuit board assembly.

20. The computer motherboard assembly of claim 17, wherein the third printed circuit board assembly is adapted to couple the one or more central processing units of the first circuit board assembly and the second circuit board assembly.

21. The computer motherboard assembly of claim 17, wherein the third printed circuit board is configured to route a first group of high speed signals from the first printed circuit board and the second printed circuit board to a left high speed peripheral device interface and a second group of high speed signals from the first printed circuit board and the second printed circuit board to a right high speed peripheral device interface.