Contact Structure and Electronic Device Including Same

2. The electronic device of claim 1, wherein the at least one contact portion is formed through cutting of at least a portion of the side member and is made of a same metal material as the side member.

3. The electronic device of claim 2, wherein the insulating portion is formed in at least a portion of the side member through insert injection molding and the cutting, and is made of a material different from a material of the contact portion.

13. The electronic device of claim 12, wherein the conductive pins include outer surfaces exposed to an outside of the electronic device without an anodized layer.