Power Efficient and Scalable Co-Packaged Optical Devices

2. The method of claim 1, wherein the digital signal is in digital format.

3. The method of claim 1, wherein the analog electrical signal transferred over the integrated electrical paths from the ASIC to the one or more co-packaged optical modules is in an analog format.

6. The method of claim 5, wherein the one or more co-packaged optical modules detect the additional optical signal using the external laser.

12. The method of claim 1, further comprising: refining the digital signal using a digital signal processing circuit, the digital signal being refined using a digital processing circuit before conversion to analog signal.

13. The method of claim 1, wherein the integrated electrical paths are in a quadrature amplitude modulation (QAM) electrical interface that transfers the analog electrical signal from the ASIC to the plurality of co-packaged optical modules.

16. The co-packaged optical-electrical chip of claim 15, wherein the symbol data generated by the plurality of symbol encoding circuits is in digital format.

17. The co-packaged optical-electrical chip of claim 16, wherein the analog electrical signal is transferred over the integrated electrical paths to the plurality of co-packaged optical modules in an analog format.

18. The co-packaged optical-electrical chip of claim 15, wherein the plurality of co-packaged optical modules receive additional optical signal.

19. The co-packaged optical-electrical chip of claim 18, wherein the plurality of co-packaged optical modules comprises one or more photodetectors to generate electrical analog signal from the additional optical signal.