Semiconductor Package Substrate with a Smooth Groove About a Perimeter of a Semiconductor Die

2. The method of claim 1, further comprising stamping the roughened surface of the metallic pad to form the groove.

3. The method of claim 1, wherein positioning the semiconductor die on the metallic pad includes identifying a location of the groove with an imaging system to locate the semiconductor die on the metallic pad such that the groove surrounds the semiconductor die.

4. The method of claim 1, wherein applying the adhesive includes identifying a location of the groove with an imaging system to locate the adhesive inside the perimeter of the groove.

6. The method of claim 1, further comprising forming wire bonds between the bond pads of the semiconductor die and the leads.

7. The method of claim 6, further comprising covering the semiconductor die, the adhesive, the roughened surface of the metallic pad, and the wire bonds with mold compound, and at least partially covering the leads with the mold compound.

8. The method of claim 1, wherein the metallic pad includes a planar base metal and layer of nickel plated on the base metal to form the roughened surface.

9. The method of claim 1, wherein the groove forms a rectangular shape surrounding the semiconductor die on the roughened surface.

10. The method of claim 1, wherein all surfaces of the metallic pad are roughened except for the groove.

11. The method of claim 1, wherein a surface roughness of the groove is less than 0.5 micrometers (μm).

12. The method of claim 1, wherein a surface roughness of the metallic pad is at least 1.0 micrometers (μm).