11840757

Film Deposition System, Factory System, and Method of Depositing Film on Wafer

PublishedDecember 12, 2023
Assigneenot available in USPTO data we have
Technical Abstract

Patent Claims
3 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The film deposition system according to claim 1, wherein an energy function of the Ising model or the QUBO indicates a value corresponding to a throughput of the film deposition apparatus.

3

3. The film deposition system according to claim 1, wherein the Ising model or the QUBO has the first elements that interact with each other due to an interaction parameter, and the interaction parameter is determined from values corresponding to a transfer time of a wafer to be deposited on and a processing time in each process required to process the transferred wafer at a specific slot in one of the chambers.

14

14. The film deposition system according to claim 13, wherein the storage reacquires a disposition of the deposition species used for prediction and a time required for the predicted film deposition as the teacher data.

Patent Metadata

Filing Date

Unknown

Publication Date

December 12, 2023

Inventors

Tsuyoshi SUZUKI
Katsuyuki NAKADA
Tomoyuki SASAKI

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Cite as: Patentable. “FILM DEPOSITION SYSTEM, FACTORY SYSTEM, AND METHOD OF DEPOSITING FILM ON WAFER” (11840757). https://patentable.app/patents/11840757

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