Merged Infrastructure for Manufacturing and Lifecycle Management of Both Hardware and Software

2. The BMC device of claim 1, wherein the indication is received from an administrative user.

3. The BMC device of claim 1, wherein the external connector is connected to the communication interface of the BMC device via a path that does not include the main processor of the main circuit board.

4. The BMC device of claim 1, wherein the recovery operation includes using the copy of the firmware to reflash the main processor.

5. The BMC device of claim 1, wherein the indication comprises an indication that the main circuit board has experienced a failure from which the main circuit board is not able to recover.

6. The BMC device of claim 1, wherein the indication comprises an indication that the main circuit board has been compromised.

7. The BMC device of claim 6, wherein the recovery operation includes performing at least a partial forced shutdown of the main circuit board.

8. The BMC device of claim 7, wherein the at least the partial forced shutdown includes cutting power to a component of the main circuit board.

9. The BMC device of claim 1, wherein the recovery operation includes resetting one or more devices, components, and sub-systems of the main circuit board to an initial state.

10. The BMC device of claim 1, wherein the indication comprises an indication to upgrade the firmware associated with the main circuit board, the copy comprises a copy of upgraded firmware associated with the main circuit board, and the recovery operation comprises installing the upgraded firmware on the main circuit board.

12. The method of claim 11, wherein the external connector is connected to the communication interface of the BMC device via a path that does not include the main processor of the main circuit board.

13. The method of claim 11, wherein the recovery operation includes using the copy of the firmware to reflash the main processor.

14. The method of claim 11, wherein the indication comprises an indication that the main circuit board has experienced a failure from which the main circuit board is not able to recover.

16. The computer program product of claim 15, wherein the recovery operation includes using the copy of the firmware to reflash the main processor.

17. The computer program product of claim 15, wherein the indication comprises an indication that the main circuit board has experienced a failure from which the main circuit board is not able to recover.