Wafer Searching Method and Device

12. The wafer searching method according to claim 1, wherein in response to determining that the first significant distribution feature and any one of the second significant distribution features in the at least one second specific area both correspond to one same preset distribution feature of a plurality of preset distribution features, it is determined that the first significant distribution feature corresponds to the any one of the second significant distribution features in the at least one second specific area.

13. The wafer searching method according to claim 1, wherein each of the failed dies and each of the normal dies of the target wafer and the reference wafer comprise normalized coordinates.