Legal claims defining the scope of protection, as filed with the USPTO.
2. The collation apparatus according to claim 1, wherein the processor is configured to execute the instructions to output the management information to a user's device.
3. The collation apparatus according to claim 1, wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.
5. The collation method according to claim 4, wherein the outputting step comprises outputting the management information to a user's device.
6. The collation method according to claim 4, wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.
8. The collation system according to claim 7, wherein the processor is configured to execute the instructions to output the management information to a user's device.
9. The collation system according to claim 7, wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.
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May 14, 2024
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