Circuit Carrier

2. The circuit carrier according to claim 1, wherein the N number of the second layout electrodes have at least two different shapes through formation of the extensions.

3. The circuit carrier according to claim 1, wherein any one of the extensions of the N number of the second layout electrodes is arranged adjacent to one of the first electrodes that has a slot facing toward the corresponding extension adjacent thereto.

4. The circuit carrier according to claim 3, wherein one of the two ends of any one of the conductive pillars connected to a corresponding one of the extensions is surrounded by one of the slots.

5. The circuit carrier according to claim 3, wherein any one of the slots is formed in one of the first layout electrodes, and the M number of the first layout electrodes have at least two different shapes through formation of the slots.

6. The circuit carrier according to claim 1, wherein the first electrodes are spaced apart from each other along the second direction, and the second electrodes are spaced apart from each other along the first direction.

7. The circuit carrier according to claim 1, wherein any one of the first electrodes other than the M number of the first layout electrodes has a shape different from that of each of the first layout electrodes, and wherein any one of the second electrodes other than the N number of the second layout electrodes has a shape different from that of each of the second layout electrodes.

8. The circuit carrier according to claim 1, wherein each of the first electrodes is defined as a driving electrode (TX), and each of the second electrodes is defined as a sensing electrode (RX).

10. The circuit carrier according to claim 9, wherein the capacitive electrode layer includes a plurality of second connection segments, and wherein any one of the second connection segments connects two of the second electrodes, so that the second electrodes and the second connection segments jointly form a plurality of second layout patterns spaced apart from each other along the first direction.

11. The circuit carrier according to claim 10, wherein any two of the second layout patterns adjacent to each other are provided with at least two of the first layout patterns therebetween arranged in one row along the second direction.

12. The circuit carrier according to claim 10, wherein each of the second layout patterns includes a main chain structure having N number of the second electrodes arranged in one row along the second direction and the corresponding second connection segments connected thereto, where N is a positive integer being greater than one.

13. The circuit carrier according to claim 12, wherein each of the second layout patterns further includes a plurality of branched chain structures each having at least two of the second electrodes and the corresponding second connection segment connected thereto, and wherein each of the branched chain structures is connected to one side of the main chain structure through one of the second connection segments thereof.

14. The circuit carrier according to claim 13, wherein, in each of the second layout patterns, a quantity of the second electrodes of the branched chain structures is equal to a quantity of the second electrodes of the main chain structures.

15. The circuit carrier according to claim 13, wherein the main chain structures of any two of the second layout patterns adjacent to each other are provided with at least two of the first layout patterns therebetween that are arranged in one row along the second direction and that are shaped to surround the at least two of the second electrodes of one of the branched chains structures in the any two of the second layout patterns.

16. The circuit carrier according to claim 10, wherein the first layout patterns arranged in one column along the first direction are separate from each other by the second layout patterns and are electrically coupled to each other through the metal pads, the bridges, and the conductive pillars.

17. The circuit carrier according to claim 9, wherein the first electrode and the second electrodes are regularly arranged in a regular staggered manner.

19. The circuit carrier according to claim 18, wherein the two metal pads are disposed on the die-bonding region.

20. The circuit carrier according to claim 18, wherein the two metal pads are disposed on the peripheral region.