Printed Circuits with Embedded Resistive Thermal Devices

3. The electronic device of claim 2, wherein the conductive traces have one or more bends.

4. The electronic device of claim 1, wherein an entirety of the RTD overlaps the electrical component.

6. The electronic device of claim 1, wherein the RTD is configured to measure a temperature.

7. The electronic device of claim 6, wherein the electrical component is adjusted based on the temperature.

9. The electronic device of claim 8, wherein the RTD is configured to measure heat produced by the electrical component.

10. The electronic device of claim 8, wherein the RTD at least partially overlaps the electrical component.

11. The electronic device of claim 8, wherein the electrical component is adjustable based on a temperature measured using the RTD.

12. The electronic device of claim 8, wherein the RTD comprises conductive traces on a flexible printed circuit that is different from the printed circuit board.

13. The electronic device of claim 8, wherein the printed circuit board is a rigid printed circuit board.

14. The electronic device of claim 8, wherein the RTD comprises meandering conductive traces.

16. The printed circuit board of claim 15, wherein the stacked layers are rigid.

17. The printed circuit board of claim 15, wherein the meandering conductive trace at least partially overlaps the surface-mounted electrical component.

18. The printed circuit board of claim 17, wherein an entirety of the meandering conductive trace overlaps the surface-mounted electrical component.

20. The printed circuit board of claim 15, further comprising a resistive thermal device (RTD) that includes the meandering conductive trace, the first contact pad, and the second contact pad.