Electrical Communication System for Circuitry

1. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuitry, and wherein said second contact pad is free from direct coupling to said first contact pad.

2. The electrical communication system in claim 1 , wherein said first contact pad is configured to transmit a row command.

3. The electrical communication system in claim 1 , wherein said first contact pad is configured to transmit an address command.

4. The electrical communication system in claim 1 , wherein said first contact pad is configured to transmit a strobe command.

5. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuitry; wherein said first contact pad is not electrically interposed between said second contact pad and said circuitry.

6. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuit independently with respect to said first contact pad.

7. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuit exclusively with respect to said first contact pad.

8. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuitry; wherein said first contact pad and said second contact pad share a common substrate and are configured to transmit selectively with respect to each other.

9. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuitry, and wherein said first contact pad is free from electrical interposition between said circuitry and said second contact pad.

10. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuit to the exclusion of said first contact pad.

11. An electrical communication system for circuitry, comprising: a first contact pad coupled to said circuitry and configured to transmit a command to said circuitry; and a second contact pad coupled to said circuitry in an area that accommodates testing moreso than said first contact pad, wherein said second contact pad is configured to transmit said command to said circuitry, and wherein said second contact pad is at most indirectly coupled to said first contact pad.