Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for inspecting a semiconductor wafer set, comprising: initially determining a baseline greyscale difference representation for at least one baseline semiconductor wafer subjected to a process, wherein the baseline greyscale difference representation represents a difference between a baseline preprocess greyscale representation and a baseline postprocess greyscale representation; determining a preprocess greyscale representation for one wafer in the semiconductor wafer set; subjecting the one wafer in the semiconductor wafer set to the process; determining a postprocess greyscale representation of the one wafer in the semiconductor wafer set; determining a difference for the one wafer in the semiconductor set, wherein the difference represents any disparity between preprocess and post process greyscale representations of the one wafer in the semiconductor set; and comparing the difference to the baseline greyscale difference representation.
2. The method of claim 1 , further comprising: determining an additional preprocess greyscale representation for an additional wafer in the semiconductor wafer set subsequent to said determining of the preprocess greyscale representation; subjecting the additional wafer in the semiconductor wafer set to the process subsequent to said subjecting the wafer in the semiconductor wafer set to the process; determining an additional postprocess greyscale representation of the additional wafer in the semiconductor wafer set subsequent to said determining the postprocess greyscale representation; determining an additional difference for the additional wafer in the semiconductor set subsequent to said determining the difference for the additional wafer, wherein the additional difference represents any disparity between preprocess and post process greyscale representations of the additional one wafer in the semiconductor set; and comparing the additional difference to the baseline greyscale difference representation.
3. The method of claim 2 , wherein the one wafer comprises a first wafer to be exposed to the process, and the additional wafer comprises a last wafer to be exposed to the process.
4. The method of claim 1 , wherein: said preprocess greyscale representation comprises a preprocess numeric value; said postprocess greyscale representation comprises a postprocess numeric value; and said difference determining comprises determining a magnitude of the difference between the preprocess numeric value and the postprocess numeric value.
5. The method of claim 4 , wherein: the baseline preprocess greyscale representation comprises a baseline preprocess numeric value; the baseline postprocess greyscale representation comprises a baseline postprocess numeric value; and the baseline greyscale difference representation represents a magnitude of the difference between the baseline preprocess numeric value and the baseline postprocess numeric value.
6. The method of claim 1 , wherein determining the preprocess greyscale representation for the one wafer comprises inspecting the wafer and assigning a preprocess greyscale value representing greyscale level for all pixels in the preprocess greyscale representation.
7. The method of claim 6 , wherein determining the postprocess greyscale representation for the one wafer comprises inspecting the wafer and assigning a postprocess greyscale value representing greyscale level for all pixels in the postprocess greyscale representation.
8. The method of claim 1 , further comprising: evaluating the comparison between the difference to the baseline representation, and if outside a predetermined threshold, investigating the one wafer for specific defects.
9. The method of claim 1 , further comprising: evaluating the comparison between the difference to the baseline representation, and if outside a predetermined threshold, considering the one wafer defective.
10. The method of claim 1 , further comprising: determining a subsequent preprocess greyscale representation for the one wafer in the semiconductor wafer set; subjecting the one wafer in the semiconductor wafer set to a second process; determining a subsequent postprocess greyscale representation of the one wafer in the semiconductor wafer set; and determining a difference for the one wafer in the semiconductor set, wherein the difference represents any disparity between subsequent preprocess and subsequent post process greyscale representations of the one wafer in the semiconductor set.
11. The method of claim 10 , wherein the subsequent preprocess greyscale representation is similar to the postprocess greyscale representation.
12. A method for inspecting a wafer, comprising: initially determining a baseline greyscale difference representation for at least one baseline semiconductor wafer subjected to a process; determining a preprocess greyscale representation for the wafer subsequent to said initially determining the baseline greyscale difference representation; subjecting the wafer to the process; determining a postprocess greyscale representation for the wafer; determining a difference for the wafer, wherein the difference represents any disparity between preprocess and postprocess greyscale representations of the wafer; and comparing the wafer difference to the baseline greyscale difference representation.
13. The method of claim 12 , wherein the at least one baseline semiconductor wafer has been exposed to the process.
14. The method of claim 13 , wherein the baseline greyscale difference representation represents a difference between a baseline preprocess greyscale representation and a baseline postprocess greyscale representation of the baseline semiconductor wafer.
15. The method of claim 14 , wherein: the baseline preprocess greyscale representation comprises a baseline preprocess numeric value; the baseline postprocess greyscale representation comprises a baseline postprocess numeric value; and the baseline greyscale difference representation represents a magnitude between the baseline preprocess numeric value and the baseline postprocess numeric value.
16. The method of claim 13 , wherein comparing the wafer difference to the baseline greyscale difference representation occurs subsequent to determining the wafer difference.
17. The method of claim 12 , wherein: said preprocess greyscale representation comprises a preprocess numeric value; said postprocess greyscale representation comprises a postprocess numeric value; and said wafer difference determining comprises determining a magnitude of the difference between the preprocess numeric value and the postprocess numeric value.
18. The method of claim 12 , wherein determining the preprocess greyscale representation for the one wafer comprises inspecting the wafer and assigning a preprocess greyscale value representing greyscale level for all pixels in the preprocess greyscale representation.
19. The method of claim 12 , further comprising: evaluating the comparison between the wafer difference to the baseline representation, and if outside a predetermined threshold, investigating the wafer for specific defects.
20. The method of claim 12 , further comprising: evaluating the comparison between the wafer difference to the baseline representation, and if outside a predetermined threshold, considering the wafer defective.
21. The method of claim 12 , further comprising: determining a subsequent preprocess greyscale representation for the wafer; subjecting the wafer to a second process; determining a subsequent postprocess greyscale representation of the wafer; and determining a difference for the wafer, wherein the difference represents any disparity between subsequent preprocess and subsequent post process greyscale representations of the wafer.
22. A method for inspecting a specimen, comprising: initially determining a baseline greyscale difference representation for at least one baseline semiconductor wafer subjected to a process; computing a preprocess numeric greyscale value representing a preprocess greyscale representation of the specimen subsequent to said initially determining the baseline greyscale difference representation; subjecting the specimen to the process; computing a postprocess numeric greyscale value representing a postprocess greyscale representation of the specimen; comparing the preprocess numeric greyscale value to the postprocess numeric greyscale value to determine a specimen difference; and comparing the specimen difference to the baseline grayscale difference representation representing baseline grayscale difference for at least one baseline specimen.
23. The method of claim 22 , wherein the at least one baseline specimen is subjected to the process prior to determining the preprocess greyscale representation for the specimen.
24. The method of claim 23 , wherein the baseline greyscale difference representation represents a difference between a baseline preprocess greyscale representation and a baseline postprocess greyscale representation of the baseline specimen.
25. The method of claim 24 , wherein said comparing comprises determining a magnitude between preprocess and postprocess numeric representations of the specimen.
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November 25, 2008
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