7558062

Heat-Dissipating Module and Electronic Apparatus

PublishedJuly 7, 2009
Assigneenot available in USPTO data we have
Technical Abstract

Patent Claims
18 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A heat-dissipating module adapted for cooling a heat-generating element, the heat-dissipating module comprising: a first heat-conducting plate thermally coupled to the heat-generating element; a first heat-dissipating tube having a first opening and a second opening opposite to the first opening, wherein the first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube; a second heat-conducting plate, thermally coupled to the heat-generating element, wherein the second heat-conducting plate is connected to the first heat-conducting plate at an angle; and a fan located at the second heat-conducting plate and adjacent and corresponding to the first opening, wherein the fan is adapted to generate an air current flowing in the first heat-dissipating tube.

2

2. The heat-dissipating module in accordance with claim 1 , wherein the first heat-dissipating tube is reel-shaped.

3

3. The heat-dissipating module in accordance with claim 1 , wherein the first heat-dissipating tube includes an uneven tube wall.

4

4. The heat-dissipating module in accordance with claim 1 , wherein the first heat-dissipating tube includes a tube wall and a plurality of heat-dissipating fins disposed on the tube wall and located within the first heat-dissipating tube.

5

5. The heat-dissipating module in accordance with claim 1 , wherein the second heat-conducting plate has a fifth opening, and the fan passes through the second heat-conducting plate by the fifth opening of the second heat-conducting plate.

6

6. The heat-dissipating module in accordance with claim 5 , wherein the fan passes through the second heat-conducting plate by the fifth opening of the second heat-conducting plate and is fixed to the second heat-conducting plate with two fixing members.

7

7. The heat-dissipating module in accordance with claim 1 , further comprising a second heat-dissipating tube having a third opening and a fourth opening opposite to the third opening, wherein the first heat-conducting plate is connected to the second heat-dissipating tube and located at an outside of the second heat-dissipating tube, and the third opening is located adjacent to the second opening and corresponding to the second opening.

8

8. The heat-dissipating module in accordance with claim 7 , wherein the shape of the second heat-dissipating tube is the same as the shape of the first heat-dissipating tube.

9

9. An electronic apparatus, comprising: a housing; a heat-generating element located within the housing; and a heat-dissipating module located within the housing, the heat-dissipating module including: a first heat-conducting plate thermally coupled to the heat-generating element; a first heat-dissipating tube having a first opening and a second opening opposite to the first opening, wherein the first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube; a second heat-conducting plate, thermally coupled to the heat-generating element, wherein the second heat-conducting plate is connected to the first heat-conducting plate at an angle; and a fan located at the second heat-conducting plate and adjacent and corresponding to the first opening, wherein the fan is adapted to generate an air current flowing in the first heat-dissipating tube.

10

10. The electronic apparatus in accordance with claim 9 , wherein the first heat-conducting plate is adapted to rotate around a rotation axis from a first position in which the heat-conducting plate within the housing covers the heat-generating element to a second position outside the housing.

11

11. The electronic apparatus in accordance with claim 10 , wherein the rotation axis passed through the first opening and the second opening.

12

12. The electronic apparatus in accordance with claim 9 , wherein the second heat-conducting plate has a fifth opening by which the fan passes through and is fixed within the housing, and the first heat-conducting tube is adapted to rotate relatively to the fan.

13

13. The electronic apparatus in accordance with claim 12 , wherein the fan passes through the second heat-conducting plate by the fifth opening of the second heat-conducting plate and is fixed to the second heat-conducting plate with two fixing members, the fixing members are located on different sides of the fan and are slidingly disposed in two arc-shaped rails of the housing, respectively, and the first heat-dissipating tube and the fan are adapted to rotate relatively to the housing.

14

14. The electronic apparatus in accordance with claim 9 , wherein the first heat-dissipating tube is reel-shaped.

15

15. The electronic apparatus in accordance with claim 9 , wherein the first heat-dissipating tube includes an uneven tube wall.

16

16. The electronic apparatus in accordance with claim 9 , wherein the first heat-dissipating tube includes a tube wall and a plurality of heat-dissipating fins disposed on the tube wall and located within the first heat-dissipating tube.

17

17. The electronic apparatus in accordance with claim 9 , wherein the heat-dissipating module further includes a second heat-dissipating tube having a third opening and a fourth opening opposite to the third opening, the first heat-conducting plate is connected to the second heat-dissipating tube and located at an outside of the second heat-dissipating tube, and the third opening is located adjacent to the second opening and corresponding to the second opening.

18

18. The electronic apparatus in accordance with claim 17 , wherein the shape of the second heat-dissipating tube is the same as the shape of the first heat-dissipating tube.

Patent Metadata

Filing Date

Unknown

Publication Date

July 7, 2009

Inventors

Feng-Ku Wang
Yi-Lun Cheng
Chun-Lung Lin
Chih-Kai Yang
Cheng-Shi Liu

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HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS — Feng-Ku Wang | Patentable