Cooling Device and Electronic Apparatus Using the Same

1. A cooling system for an electronic apparatus for cooling a semiconductor device on an electronic circuit substrate mounted on the electronic apparatus, wherein the electronic circuit substrate is detachably installed in a casing which forms the electronic apparatus, the cooling system is formed of a heat transfer member and a cooling member which are separately formed, each having a sealed structure which contains a refrigerant, the heat transfer member includes a first heat transfer portion thermally connected to the semiconductor device at one end, and a second heat transfer portion thermally connected to the cooling member at the other end, and is detachable with respect to the casing together with the electronic circuit substrate when the electronic circuit substrate is inserted into or detached from the casing of the electronic circuit substrate, the second heat transfer portion of the heat transfer member is disposed inside or outside the casing of the electronic apparatus by mounting the electronic circuit substrate on the electronic apparatus, the heat transfer member has a sealed tubular configuration containing a phase-change refrigerant, the refrigerant is vaporized by absorbing heat from the semiconductor device for heat reception at the first heat transfer portion, the refrigerant vaporized in the first heat transfer portion of the heat transfer member is liquefied to transfer the heat to the cooling member by absorbing the heat from the thermally connected cooling member at the second heat transfer portion, the cooling member is any one of an air cooling member using a cooling fan and a liquid cooling member for circulating the refrigerant, which is selected in accordance with a heat generation amount of the semiconductor device, and thermally connected at the second heat transfer portion of the heat transfer member to perform heat transfer with the heat transfer member, the liquid cooling member includes a sealed passage which connects between a thermal connector thermally connected to an outer peripheral wall of the second heat transfer portion of the heat transfer member and a radiator as a heat releasing portion with a pipe, the refrigerant being circulated in the sealed passage, the thermal connector has a substantially cylindrical hollow joint structure which encloses an outer peripheral wall of the second heat transfer portion of the heat transfer member, and an inside of the thermal connector is divided into a plurality of passages with a plurality of circular partitions.

2. The cooling system for an electronic apparatus according to claim 1 , wherein the air-cooling member includes a thermal connector thermally connected to an outer peripheral wall of the second heat transfer portion of the heat transfer member, a heat sink formed of a fin integrated with the thermal connector, and a fan for blowing air.

3. The cooling system for an electronic apparatus according to claim 1 , wherein the cooling member is disposed outside the electronic apparatus, and any one of the air cooling member and the liquid cooling member is selectively and exclusively connected thermally to the second heat transfer portion of the heat transfer member.

4. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising: a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion; and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion; wherein the first heat absorbing portion is disposed in contact with the semiconductor device; the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion; wherein a phase-change refrigerant is contained in the first cooling unit; wherein the second heat releasing portion is disposed outside the casing wherein the second cooling unit includes a thermal connector comprising the second heat absorbing portion, the second cooling unit being selectable between a first constitution that the second cooling unit has the liquid contained therein and the circulating member and a second constitution that the second cooling unit does not have the liquid contained therein and the circulating member, in accordance with a heat generation amount of the semiconductor device; and wherein the thermal connector includes a plurality of partitions for dividing an inner space thereof into a plurality of liquid passages.

5. The cooling device according to claim 4 , wherein the refrigerant is a liquid.

6. The cooling device according to claim 5 , wherein the refrigerant vaporized by the first heat absorbing portion is liquefied in the first heat releasing portion.

7. The cooling device according to claim 4 , wherein the first cooling unit is detachable integrally together with the electronic circuit substrate with respect to the casing upon attachment and detachment of the electronic circuit substrate.

8. The cooling device according to claim 4 , wherein the second cooling unit includes a heat sink formed of a solid thermal member.

9. The cooling device according to claim 4 , wherein a liquid is contained in the second cooling unit.

10. The cooling device according to claim 9 , further comprising a circulating member for circulating the liquid contained in the second cooling unit.

11. The cooling device according to claim 4 , wherein a cooling fan is provided for cooling the second heat releasing portion with air.

12. The cooling device according to claim 4 , wherein the thermal connector has a hollow joint structure connectable to an outer peripheral wall of the first heat releasing portion.

13. The cooling device according to claim 4 , wherein the second cooling unit includes a fin integrally formed with the thermal connector.

14. The cooling device according to claim 4 , wherein the second cooling unit is configured so that various cooling performances of the second cooling unit can be exclusively selected.

15. An electronic apparatus comprising the cooling device according to claim 4 .