Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A speed-up booting module of an electronic device, comprising: a first heat pipe, comprising a hot end connected to a first component; a cold end connected to a second component; and a first working fluid; wherein when a booting process is performed at a first environmental temperature, the first environmental temperature is higher than or equal to a boiling point of the first working fluid, the heat from the first component in operation is transferred to the second component, so that a temperature of the second component reaches an operating temperature of the second component; and a second heat pipe, comprising a hot end connected to the first component; a cold end connected to a third component; and a second working fluid, a boiling point of the second working fluid of the second heat pipe being higher than the boiling point of the first working fluid of the first heat pipe; wherein at a second environmental temperature, a temperature of the second working fluid reaches a boiling point of the second working fluid, the heat from the first component in operation is transferred heat to the third component.
A speed-up booting module for electronic devices uses two heat pipes to quickly bring components to operating temperature. The first heat pipe connects a component that generates heat during booting (first component) to another component that needs to reach a specific temperature to operate (second component). This heat pipe contains a fluid with a relatively low boiling point. When the device boots at a typical temperature (first environmental temperature), the heat from the first component warms the second component. A second heat pipe also connects the first component to a third component, but uses a fluid with a higher boiling point. At higher temperatures (second environmental temperature), this second heat pipe activates, transferring heat from the first component to the third component.
2. The speed-up booting module of the electronic device according to claim 1 , wherein the first environmental temperature is less than or equal to the boiling point of the second working fluid of the second heat pipe.
The speed-up booting module described uses two heat pipes with different working fluids. The typical operating temperature (first environmental temperature) of the electronic device is set so it's at or below the boiling point of the working fluid within the second heat pipe. This ensures that the second heat pipe, designed for higher temperatures, remains inactive during normal operation, and only the first heat pipe (with the lower boiling point fluid) transfers heat to the second component.
3. The speed-up booting module of the electronic device according to claim 1 , wherein the second environmental temperature is higher than the first environmental temperature.
The two heat pipe booting system operates at different temperatures. The standard operating temperature (first environmental temperature) is lower than the higher temperature (second environmental temperature) required to activate the second heat pipe. This ensures the heat pipes activate sequentially as the device warms up.
4. The speed-up booting module of the electronic device according to claim 1 , wherein the first working fluid is Freon-22, NH3, Freon-113, Acetone (C3H6O), Methanol or water (H2O).
The speed-up booting module's first heat pipe uses a fluid selected for its low boiling point. Suitable working fluids for this first heat pipe include Freon-22, NH3 (Ammonia), Freon-113, Acetone (C3H6O), Methanol, or water (H2O), chosen to efficiently transfer heat at lower temperatures to bring the second component to operating temperature quickly.
5. The speed-up booting module of the electronic device according to claim 1 , wherein the second working fluid is water.
The speed-up booting module's second heat pipe, designed for higher temperatures, uses water as its working fluid. Water's higher boiling point allows it to remain inactive until the electronic device reaches a hotter operating temperature.
6. The speed-up booting module of the electronic device according to claim 5 , wherein a pressure of the second heat pipe is greater than 18.5 kilopascals (kPa).
The speed-up booting module's second heat pipe, which uses water as a working fluid, operates at a pressure greater than 18.5 kilopascals (kPa). This pressure ensures that the water remains in a liquid state at higher temperatures, enabling efficient heat transfer to the third component.
7. The speed-up booting module of the electronic device according to claim 1 , wherein the first working fluid is water, a pressure of the first heat pipe is between 6 kPa to 10 kPa, the second working fluid is water, and a pressure of the second heat pipe is greater than 18.5 kPa.
In the speed-up booting module, the first heat pipe uses water as a working fluid at a pressure between 6 kPa and 10 kPa, while the second heat pipe also uses water, but at a higher pressure, exceeding 18.5 kPa. This pressure difference ensures that the first heat pipe activates at a lower temperature for initial booting, and the second heat pipe activates at a higher temperature.
8. The speed-up booting module of the electronic device according to claim 1 , wherein when the booting process is performed at the first environmental temperature, a first power supply is provided so that a first thermal change of the first component is generated, and the first working fluid of the first heat pipe transfers the heat from the first component to the second component, the temperature of the second component reaches the operating temperature of the second component.
During the booting process at a typical temperature (first environmental temperature), a power supply activates the first component, causing it to generate heat. The working fluid inside the first heat pipe absorbs this heat and transfers it to the second component, raising the second component's temperature until it reaches its required operating temperature for the device to boot correctly.
9. The speed-up booting module of the electronic device according to claim 1 , wherein when the electronic device is at the second environmental temperature, a second power supply is provided to the first component so that a second thermal change of the first component is generated, the first working fluid of the first heat pipe transfers the heat from the first component to the second component, and the second working fluid of the second heat pipe transfers the heat from the first component to the third component.
When the electronic device operates at a higher temperature (second environmental temperature), a power supply activates the first component, generating heat. The first heat pipe transfers heat to the second component, while the second heat pipe simultaneously transfers heat to the third component. Both heat pipes are active, allowing the device to distribute heat effectively and maintain stable operation.
10. The speed-up booting module of the electronic device according to claim 1 , further comprising: a power supply device for supplying power to the first component so that the first component is operated to generate the heat.
The speed-up booting module includes a power supply that provides electricity to the first component. This power supply enables the first component to generate heat, which is then transferred by the heat pipes to other components, speeding up the overall booting process and temperature stabilization.
11. The speed-up booting module of the electronic device according to claim 1 , further comprising: a thermal sensor for detecting the temperature of the second component.
The speed-up booting module contains a temperature sensor that monitors the temperature of the second component. This sensor allows the system to track when the second component reaches its optimal operating temperature, ensuring that the booting process is proceeding correctly and allowing for adjustments if needed.
12. A method for speed-up booting an electronic device, comprising: providing a first heat pipe, the first heat pipe comprising a hot end connected to a first component, a cold end connected to a second component, and a first working fluid; providing a second heat pipe, the second heat pipe comprising a hot end connected to the first component, a cold end connected to a third component, and a second working fluid, wherein a boiling point of the second working fluid of the second heat pipe is higher than a boiling point of the first working fluid of the first heat pipe; performing a booting process to provide a first power supply at an first environmental temperature, the first power supply being supplied to the first component, wherein the first component generates a first thermal change and the first working fluid of the first heat pipe transfers heat from the first component to the second component, so that a temperature of the second component reaches an operating temperature of the second component; booting the second component to complete the booting process; and providing a second power supply, the second power supply being supplied to the first component, wherein the first component generates a second thermal change and the first working fluid of the first heat pipe transfers heat from the first component to the second component, and the second working fluid of the second heat pipe transfers the heat from the first component to the third component.
A method for speeding up the boot process of an electronic device involves using two heat pipes. The first heat pipe connects a heat-generating component (first component) to a second component needing heat for booting. The second heat pipe connects the first component to a third component. The second heat pipe's working fluid has a higher boiling point than the first. During booting at a typical temperature, the first heat pipe transfers heat from the first to the second component until the second component reaches operating temperature, completing that phase of booting. Later, more power is supplied to the first component, so that both heat pipes transfer heat - the first to the second component, and the second to the third.
13. The method for speed-up booting the electronic device according to claim 12 , wherein the first working fluid is Freon-22, NH3, Freon-113, Acetone, Methanol or water.
In the method for speeding up electronic device booting using two heat pipes, the working fluid for the first heat pipe can be Freon-22, NH3 (Ammonia), Freon-113, Acetone, Methanol, or water. This fluid transfers heat from a first component to a second to enable faster booting.
14. The method for speed-up booting the electronic device according to claim 12 , wherein the second working fluid is water.
In the method for speeding up electronic device booting using two heat pipes, the working fluid for the second heat pipe is water. This second heat pipe transfers heat from the first component to the third at higher temperatures.
15. The method for speed-up booting the electronic device according to claim 14 , wherein a pressure of the second heat pipe is greater than 18.5 kPa.
In the method for speeding up electronic device booting with two heat pipes, where the second heat pipe uses water, the pressure inside this second heat pipe is maintained above 18.5 kPa. This ensures efficient heat transfer.
16. The method for speed-up booting the electronic device according to claim 12 , wherein the first working fluid is water, a pressure of the first heat pipe is between 6 kPa to 10 kPa, the second working fluid is water, and a pressure of the second heat pipe is greater than 18.5 kPa.
In the two heat pipe boot method, the first heat pipe uses water at a pressure between 6 kPa and 10 kPa, while the second heat pipe uses water at a pressure greater than 18.5 kPa. These pressure differences ensure that the heat pipes activate at different temperature thresholds, optimising the booting process.
17. The method for speed-up booting the electronic device according to claim 12 , wherein the first environmental temperature is less than or equal to the boiling point of the second working fluid of the second heat pipe.
The method for speeding up electronic device booting using two heat pipes has a first environmental temperature is less than or equal to the boiling point of the second working fluid of the second heat pipe. This ensures the first heat pipe is responsible for initial heat transfer to boot the device.
Unknown
September 30, 2014
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