Legal claims defining the scope of protection, as filed with the USPTO.
1. A network signal enhancement circuit assembly, comprising a circuit board and a processing circuit installed in said circuit board, said processing circuit comprising a first connection end electrically connected to a network connector for receiving an network signal from said network connector, a second connection end electrically connected to a network-on-chip and adapted for outputting said network signal to said network-on-chip, a plurality of two-wire channels connected in parallel between said first connection end and said second connection end, each said two-wire channel comprising two wires electrically connected in parallel between said first connection end and said second connection end, a plurality of coupling modules respectively electrically coupled between said first connection end and said second connection end, and a plurality of EMI protection modules respectively electrically coupled between said first connection end and said second connection end, wherein said processing circuit further comprises a signal enhancement module electrically coupled between said first connection end and said second connection end and set between said EMI protection modules and said second connection end, said signal enhancement module comprising a voltage source, and a plurality of pull-up resistors electrically connected to said voltage source and respectively electrically connected in parallel to the wires of said two-wire channels.
2. The network signal enhancement circuit assembly as claimed in claim 1 , wherein said circuit board carries said network-on-chip thereon; said processing circuit is electrically connected to said network-on-chip at said circuit board and electrically connected to said network connector at an external circuit system.
3. The network signal enhancement circuit assembly as claimed in claim 1 , wherein said processing circuit is installed with said circuit board in said network connector and electrically connected to said network-on-chip at an external circuit system.
4. The network signal enhancement circuit assembly as claimed in claim 1 , wherein the resistance values of said pull-up resistors of said signal enhancement module are preferably in the range of 100 Ohm˜100K Ohm.
5. The network signal enhancement circuit assembly as claimed in claim 1 , wherein each said coupling module comprises two first capacitors respectively electrically connected in series to the two wires of one respective said two-wire channel.
6. The network signal enhancement circuit assembly as claimed in claim 1 , wherein each said EMI protection module comprises two second capacitors electrically connected in series and then electrically connected in parallel to the two wires of one respective said two-wire channel with the connecting point between said two second capacitors electrically connected to a common grounding terminal, and two inductors respectively electrically connected in series to said two second capacitors.
7. The network signal enhancement circuit assembly as claimed in claim 1 , wherein the resistance value of said pull-up resistors of said signal enhancement module are most preferably 10K Ohm.
Unknown
February 23, 2016
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