9612273

Distributed Wafer Inspection

PublishedApril 4, 2017
Assigneenot available in USPTO data we have
Technical Abstract

Patent Claims
20 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A system for inspecting a surface with cloud based processing, comprising: an inspection module to generate surface data by inspecting a surface; a client connected to said inspection module having a processor configured to: compress the size of said surface data to generate compressed surface data; packetize said compressed surface data to generate packetized surface data; a bidirectional communication pathway configured to: i. transfer said packetized surface data from said client to a cloud, wherein said cloud comprises multiple interconnected computing nodes that are remotely located from said client; ii. transfer surface properties and surface analytics from said cloud to said client; and a processor located in said cloud configured to: reconstruct said packetized surface data to generate said compressed surface data; decompress the size of said compressed surface data to generate said surface data; i. compute said surface properties using said surface data; ii. compute said surface analytics from said surface properties and a prior information set, wherein said prior information set is a collection of surface properties, previously stored in said cloud, obtained by inspecting at least two surfaces, whereby said surface properties and said surface analytics are reliably used to improve the yield of an article produced with said surface.

2

2. The system of claim 1 , wherein said surface data is stored in said cloud.

3

3. The system of claim 1 , wherein said surface data comprises a digital representation of an electromagnetic radiation scattered from said surface.

4

4. The system of claim 1 , wherein said surface properties comprise position and size of features located on said surface.

5

5. The system of claim 1 , wherein said surface properties comprise shape and thickness.

6

6. The system of claim 1 , wherein said surface analytics comprises a trend of variation in one or more surface properties.

7

7. The system of claim 1 , wherein said surface analytics comprises a list of said surface properties that are likely to cause a negative impact on production yield.

8

8. The system of claim 1 , wherein said cloud is a private cloud.

9

9. The system of claim 1 , wherein said cloud is a hybrid cloud.

10

10. The system of claim 1 , wherein said cloud is a public cloud.

11

11. The system of claim 1 , wherein said packetized surface data is generated according to the internet protocol suite.

12

12. The system of claim 1 , further comprising a processor in cloud configured to generate packets comprising said surface properties and said surface analytics according to the internet protocol suite.

13

13. The system of claim 1 , wherein said communication pathway comprises an optical fiber.

14

14. The system of claim 1 , wherein said communication pathway comprises a twisted pair copper cable.

15

15. The system of claim 1 , wherein said communication pathway comprises a wireless router.

16

16. The system of claim 1 , wherein said communication pathway comprises a coax cable.

17

17. A method for inspecting a surface with cloud based processing, comprising: generating surface data by inspecting a surface with an inspection module, wherein said inspection module is connected to a client; compressing the size of said surface data in said client to generate compressed surface data; packetizing said compressed surface data in said client to generate packetized surface data; transferring said packetized surface data from said client to a cloud, wherein said cloud comprises multiple interconnected computing nodes that are remotely located from said client; reconstructing said packetized surface data in said cloud to generate said compressed surface data; decompressing the size of said compressed surface data in said cloud to generate said surface data; computing surface properties using said surface data on said cloud; computing surface analytics in said cloud from said surface properties and a prior information set, wherein said prior information set is a collection of surface properties, previously stored in said cloud, obtained by inspecting at least two surfaces; and transferring said surface properties and said surface analytics from said cloud to said client, whereby said surface properties and said surface analytics are reliably used to improve the yield of an article produced with said surface.

18

18. The method of claim 17 , wherein said generating surface analytics comprises grouping of a subset of information in said prior information set that correspond to one or more surface properties.

19

19. The method of claim 17 , wherein said prior information set further comprises a collection of tolerable values of surface properties.

20

20. The method of claim 19 , wherein said generating surface analytics comprises comparing one or more said surface properties with said tolerable values.

Patent Metadata

Filing Date

Unknown

Publication Date

April 4, 2017

Inventors

Sri Rama Prasanna Pavani

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Cite as: Patentable. “DISTRIBUTED WAFER INSPECTION” (9612273). https://patentable.app/patents/9612273

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