Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A pattern inspecting and measuring device that performs inspection or measurement of an inspection or measurement object pattern using a position of an edge extracted, using an edge extraction parameter, from image data obtained by imaging the inspection or measurement object pattern, the pattern inspecting and measuring device comprising: a processing device and a non-transitory memory storing a program, wherein the program, when executed by the processing device, causes the processing device to: acquire the image data of inspection or measurement target pattern, generate a brightness profile of the image data, at each position of multiple different positions on a reference pattern as a reference for the inspection or a measurement, in a direction intersecting with the edge of the reference pattern, define an interval for extracting edge extraction parameter of the brightness profile with respect to the edge position of the different object pattern based on the edge of the reference pattern, set the threshold value for each different position, depending on the difference of the position between the edge of the reference pattern in the defined range and the position that extracts from brightness profile, extract a new edge for each different position from the brightness profile using a threshold value set for each different position of the object pattern, compare the edge of the reference pattern and the pattern edge which generates based on the extraction of the new edge and the edge of the reference pattern, and output the comparison results.
This invention relates to a pattern inspection and measurement device designed to analyze and measure patterns on an object by extracting and comparing edge positions from image data. The device addresses the challenge of accurately detecting and measuring pattern edges, which is critical in applications like semiconductor manufacturing, where precise pattern alignment and defect detection are essential. The device includes a processing unit and a non-transitory memory storing a program that, when executed, performs several key functions. First, it acquires image data of the target pattern. Next, it generates a brightness profile of the image data at multiple positions along a reference pattern, intersecting the pattern's edge. The device then defines an interval for extracting edge parameters based on the reference pattern's edge position and sets a threshold value for each position, adjusted according to the positional difference between the reference edge and the extracted edge from the brightness profile. Using these thresholds, the device extracts new edges for each position and compares them with the reference pattern's edge. Finally, it outputs the comparison results, enabling precise pattern inspection and measurement. This approach improves accuracy by dynamically adjusting edge extraction parameters based on reference patterns, ensuring reliable detection even in varying conditions. The system enhances defect detection and alignment processes in high-precision manufacturing environments.
2. The pattern inspecting and measuring device according to claim 1 , wherein: the reference pattern is configured to include a plurality of reference edges as a point of reference when extracting the edge; and the pattern inspecting and measuring device generates an edge extraction parameter corresponding to each of the reference edges.
A pattern inspecting and measuring device is used to analyze and measure patterns, particularly in applications like semiconductor manufacturing or printed circuit board inspection. The device addresses the challenge of accurately extracting and measuring edges of patterns, which is critical for ensuring precision in manufacturing processes. The device includes a reference pattern that contains multiple reference edges, serving as benchmarks for edge extraction. By using these reference edges, the device generates specific edge extraction parameters for each one. These parameters are then applied to extract edges from the target pattern being inspected. The reference pattern and its multiple reference edges allow the device to adapt to different edge characteristics, improving the accuracy and reliability of edge detection. This approach helps mitigate errors caused by variations in pattern geometry or imaging conditions, ensuring consistent and precise measurements. The device's ability to generate distinct parameters for each reference edge enhances its flexibility and performance in various inspection scenarios.
3. The pattern inspecting and measuring device according to claim 2 , wherein: the reference edges are configured to belong to any of pattern figures reflecting a shape of the inspection or measurement object pattern; and the pattern inspecting and measuring device generates the edge extraction parameter in such a way that edge extraction parameters corresponding to respective reference edges that belong to the same pattern figure are equal to each other.
A pattern inspecting and measuring device is designed to analyze and measure patterns on an inspection or measurement object, such as a semiconductor wafer or printed circuit board. The device addresses challenges in accurately detecting and measuring edges of complex patterns, which can vary in shape and size. The device includes reference edges that correspond to specific pattern figures on the object, where each pattern figure represents a distinct shape or structure within the overall pattern. The device generates edge extraction parameters that ensure edges belonging to the same pattern figure are processed uniformly. This means that all edges within a single pattern figure share identical edge extraction parameters, improving consistency and accuracy in pattern inspection and measurement. The device dynamically adjusts these parameters based on the reference edges, allowing for precise detection of edges even in intricate or varying pattern designs. This approach enhances the reliability of pattern analysis, particularly in applications requiring high precision, such as semiconductor manufacturing or quality control in electronic components.
4. The pattern inspecting and measuring device according to claim 2 , wherein the pattern inspecting and measuring device generates the edge extraction parameter in such a way that edge extraction parameters corresponding to the respective reference edges are equal to each other.
A pattern inspecting and measuring device is used in semiconductor or microfabrication processes to analyze and measure fine patterns on substrates. The device captures images of these patterns and processes them to detect and measure edges, which is critical for ensuring precision in manufacturing. A key challenge is accurately extracting edges from noisy or low-contrast images, especially when patterns have varying features. The device includes an imaging system to capture pattern images and a processing unit that applies edge extraction techniques to identify edges within the patterns. To improve accuracy, the device generates edge extraction parameters dynamically. These parameters are adjusted based on reference edges—predefined or learned edge characteristics—to ensure consistent edge detection across different parts of the pattern. The device ensures that the edge extraction parameters for corresponding reference edges are identical, preventing inconsistencies that could lead to measurement errors. This uniformity is particularly important for high-precision applications where even minor deviations can affect product quality. The device may also include calibration mechanisms to refine the parameters based on feedback from previous inspections, enhancing reliability over time.
5. The pattern inspecting and measuring device according to according to claim 1 , wherein the pattern inspecting and measuring device outputs a statistic concerning the generated edge extraction parameter, or concerning the generated edge extraction parameter.
A pattern inspecting and measuring device is used to analyze and measure patterns, such as those found in semiconductor wafers or printed circuits, to ensure precision and quality. The device extracts edges from the pattern to determine critical dimensions, alignment, and defects. However, edge extraction can be sensitive to noise, variations in pattern contrast, or other imaging artifacts, leading to inaccuracies in measurements. This device includes a system that generates edge extraction parameters, which define how edges are identified in the pattern. The parameters may include thresholds, filters, or algorithms that adjust based on the pattern's characteristics. The device then outputs statistical data about these parameters, such as their distribution, variability, or consistency over multiple measurements. This statistical feedback helps assess the reliability of the edge extraction process, ensuring that measurements remain accurate and repeatable. By analyzing these statistics, users can detect anomalies, optimize parameter settings, or improve the device's performance in detecting defects or deviations from design specifications. The system may also compare the statistics to predefined thresholds to flag potential issues in the inspection process. This enhances the device's ability to provide precise and dependable pattern measurements.
6. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device inspects the inspection or measurement object pattern using the generated edge extraction parameter as an evaluation index.
A pattern inspecting and measuring device is designed to analyze and evaluate patterns on an inspection or measurement object. The device generates an edge extraction parameter, which is used as an evaluation index to assess the quality or characteristics of the pattern. This parameter helps in accurately identifying and measuring edges within the pattern, ensuring precise inspection and measurement. The device may include imaging components to capture the pattern, processing units to generate the edge extraction parameter, and evaluation modules to apply this parameter for inspection. The edge extraction parameter can be derived from various image processing techniques, such as gradient analysis, thresholding, or edge detection algorithms. By using this parameter, the device can detect defects, measure dimensions, or verify pattern integrity. The system may also include calibration features to optimize the edge extraction parameter for different types of patterns or materials. This technology is particularly useful in semiconductor manufacturing, printed circuit board inspection, and other fields requiring high-precision pattern analysis. The device ensures reliable and consistent pattern evaluation by leveraging the edge extraction parameter as a key evaluation metric.
7. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device inputs a minimum value and a maximum value of values that may be taken by the edge extraction parameter, and generates the edge extraction parameter in such a way that the edge extraction parameter has a value not smaller than the minimum value and not greater than the maximum value.
This invention relates to a pattern inspecting and measuring device designed to analyze and measure patterns, particularly in applications such as semiconductor manufacturing or quality control. The device extracts edges from patterns to determine their dimensions and positions accurately. A key challenge in such systems is ensuring that the edge extraction process is both precise and adaptable to varying pattern characteristics. The device includes a mechanism for generating an edge extraction parameter, which is a variable used to refine the edge detection process. To enhance flexibility, the device allows users to input a minimum and maximum value for this parameter. The system then generates the edge extraction parameter within this defined range, ensuring it does not fall below the minimum or exceed the maximum. This constraint prevents overly aggressive or insufficient edge detection, improving measurement accuracy and reliability. The parameter generation process may involve algorithms that dynamically adjust the value based on the input range, ensuring optimal edge extraction for different pattern types. This feature is particularly useful in applications where patterns vary in contrast, noise levels, or structural complexity, as it allows the device to adapt while maintaining consistent performance. The invention thus provides a robust solution for precise pattern inspection and measurement in industrial and scientific settings.
8. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device inputs a maximum value of deviation from a reference value for the edge extraction parameter, and generates the edge extraction parameter in such a way that an absolute value of a difference between the edge extraction parameter and the reference value is not greater than the maximum deviation.
The pattern inspecting and measuring device is designed for high-precision inspection and measurement of patterns, particularly in semiconductor or microfabrication applications. A key challenge in such systems is accurately extracting edges of patterns to ensure precise measurements, which can be affected by variations in edge extraction parameters. The device addresses this by dynamically adjusting edge extraction parameters to minimize deviations from a reference value, ensuring consistent and reliable edge detection. The device includes a mechanism to input a maximum allowable deviation from a reference value for the edge extraction parameter. It then generates the edge extraction parameter such that the absolute difference between the generated parameter and the reference value does not exceed this maximum deviation. This ensures that edge extraction remains stable and within acceptable limits, reducing measurement errors caused by parameter fluctuations. The system may also include components for capturing pattern images, processing these images to detect edges, and applying the adjusted edge extraction parameters to refine the detection process. By maintaining tight control over parameter deviations, the device enhances the accuracy and repeatability of pattern inspections, which is critical for quality control in manufacturing processes.
9. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device generates the reference pattern based on a position of an edge extracted from the image data using a previously given second edge extraction parameter.
A pattern inspecting and measuring device is used to analyze and measure patterns, such as those on semiconductor wafers or printed circuit boards, to detect defects or deviations from design specifications. The device captures image data of the pattern and compares it to a reference pattern to identify discrepancies. A challenge in this process is accurately generating the reference pattern to ensure precise defect detection. The device includes an edge extraction module that processes the captured image data to identify edges within the pattern. This module uses a predefined second edge extraction parameter to determine the position of these edges. The extracted edge positions are then used to generate the reference pattern, which serves as a benchmark for comparison against the actual pattern in the image data. By adjusting the second edge extraction parameter, the device can fine-tune the sensitivity and accuracy of edge detection, improving the reliability of defect identification. This approach ensures that the reference pattern closely matches the expected design, enhancing the overall inspection process.
10. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device generates the reference pattern based on an edge position extracted from second image data obtained by imaging a second inspection or measurement object pattern different from the inspection or measurement object pattern in manufacturing process.
This invention relates to pattern inspection and measurement devices used in semiconductor or microfabrication processes. The device addresses the challenge of accurately inspecting and measuring fine patterns on a substrate, such as a wafer, by generating a high-precision reference pattern for comparison against the inspected pattern. The device captures a first image of an inspection or measurement object pattern on a substrate. To generate a reference pattern, it extracts edge positions from a second image of a different pattern, obtained from the same or a similar manufacturing process. This second pattern serves as a reference, allowing the device to detect deviations in the inspected pattern by comparing it against the reference pattern derived from the second image. The use of a separate reference pattern improves accuracy, as it accounts for variations in the manufacturing process. The device may include an imaging system to capture the first and second images, an edge detection module to extract edge positions from the second image, and a comparison module to analyze differences between the inspected pattern and the reference pattern. This approach enhances defect detection and measurement precision in high-resolution pattern inspection applications.
11. The pattern inspecting and measuring device according to claim 1 , wherein the pattern inspecting and measuring device generates the reference pattern based on an edge position extracted from second image data obtained by imaging a second inspection or measurement object pattern different from the inspection or measurement object pattern in an exposure condition.
This invention relates to pattern inspection and measurement devices used in semiconductor manufacturing or similar fields, addressing the challenge of accurately detecting defects in fine patterns. The device generates a reference pattern for comparison with an inspected pattern to identify deviations. The key improvement involves generating the reference pattern from edge positions extracted from a second image of a different pattern, obtained under the same exposure conditions as the inspected pattern. This approach enhances accuracy by leveraging edge data from a similar but distinct pattern, reducing errors caused by variations in the inspected pattern itself. The device includes an imaging system to capture images of the patterns, a processing unit to extract edge positions from the second image, and a reference pattern generation module that constructs the reference pattern based on these edge positions. The reference pattern is then compared with the inspected pattern to detect defects or measure dimensions. This method improves defect detection reliability by using a more stable reference derived from a controlled, alternative pattern under identical exposure conditions. The invention is particularly useful in high-precision applications where pattern consistency is critical.
12. The pattern inspecting and measuring device according to claim 1 , wherein the inspection or measurement is performed using information about a distance between the position of the edge and a position on the reference pattern corresponding to the edge position.
A pattern inspecting and measuring device is designed to analyze and measure patterns, particularly in semiconductor or microfabrication applications. The device addresses the challenge of accurately detecting and quantifying deviations in pattern edges, which is critical for ensuring precision in manufacturing processes. The system includes a reference pattern that serves as a baseline for comparison. During inspection, the device determines the position of an edge in the pattern being analyzed and calculates the distance between this edge position and a corresponding position on the reference pattern. This distance information is then used to perform the inspection or measurement, allowing for precise detection of any discrepancies or deviations in the pattern. The device may also include imaging optics to capture the pattern, a light source to illuminate the pattern, and a processing unit to analyze the captured data. The use of distance measurements between the actual edge and the reference pattern ensures high accuracy in identifying defects or variations, which is essential for maintaining quality in high-precision manufacturing environments.
13. The pattern inspecting and measuring device according to claim 1 , wherein the reference pattern as a reference for the inspection or measurement is configured to include a plurality of reference edges as a point of reference when extracting the edge, the pattern inspecting and measuring device implements, with respect to a portion of the reference edge in which the edge corresponding to the reference edge is not present, a process of determining the edge used for the inspection or measurement using a contour line determined with the use of the image data.
A pattern inspecting and measuring device is designed to analyze and measure patterns, particularly in semiconductor or microfabrication applications. The device addresses challenges in accurately detecting and measuring edges of patterns, which is critical for ensuring precision in manufacturing processes. The system uses a reference pattern that includes multiple reference edges to guide the extraction and measurement of edges in the inspected pattern. When the inspected pattern lacks an edge corresponding to a reference edge, the device employs image data to determine a contour line. This contour line serves as a substitute for the missing edge, allowing the device to proceed with inspection or measurement without errors. The reference pattern and contour line generation ensure reliable edge detection even in imperfect or incomplete patterns, improving accuracy in quality control and defect detection. The device's ability to adapt to missing edges enhances its robustness in real-world manufacturing environments where variations and defects are common.
14. The pattern inspecting and measuring device according to claim 1 , wherein: the pattern inspecting and measuring device performs inspection or measurement of an inspection or measurement object pattern formed on the sample using image data obtained by imaging a band-like region on a sample by a charged particle beam scan; and the charged particle beam scan is performed in a direction inclined with respect to a direction perpendicular to a longitudinal direction of the band-like region.
This invention relates to a pattern inspecting and measuring device used in semiconductor or microfabrication processes to analyze patterns on samples. The device addresses the challenge of accurately inspecting and measuring fine patterns, particularly in high-resolution applications where conventional scanning methods may introduce distortions or inaccuracies. The device captures image data of a band-like region on a sample using a charged particle beam, such as an electron beam, which scans the sample in a controlled manner. The key innovation lies in the scanning direction: the charged particle beam scans the sample at an angle that is not perpendicular to the longitudinal axis of the band-like region. This inclined scanning approach helps mitigate distortions caused by beam interactions with the sample surface, improving measurement accuracy and pattern inspection quality. The device processes the obtained image data to perform precise inspections or measurements of the pattern formed on the sample. By adjusting the scanning angle relative to the band-like region, the system enhances resolution and reduces artifacts, making it suitable for advanced semiconductor manufacturing and metrology applications. The method ensures high-fidelity pattern analysis, which is critical for defect detection and process control in microfabrication.
15. The pattern inspecting and measuring device according to claim 1 , wherein: the reference pattern as a reference for the inspection or measurement is configured to include a plurality of reference edges as a point of reference when extracting the edge; and with respect to a profile generated at a position of each of the reference edges, an edge is determined using three or more mutually different edge extraction parameters to form a contour line corresponding to each of the edge extraction parameters, and the inspection or measurement is performed using the three or more contour lines that are formed.
This invention relates to pattern inspection and measurement devices used in semiconductor or microfabrication processes. The device addresses the challenge of accurately extracting and analyzing edges in patterns, which is critical for quality control and defect detection. The system uses a reference pattern containing multiple reference edges as a baseline for edge extraction. During inspection, the device generates a profile at each reference edge position and applies three or more distinct edge extraction parameters to determine multiple contour lines. These contour lines, each corresponding to a different parameter, are then used to perform the inspection or measurement. By leveraging multiple edge extraction methods, the device improves accuracy and reliability in detecting and measuring pattern features, reducing false positives and enhancing defect detection. The approach is particularly useful in high-precision applications where edge definition and consistency are critical. The reference pattern and multi-parameter extraction method ensure robust performance across varying pattern complexities and manufacturing variations.
16. A non-transitory computer-readable medium storing executable instructions, the executable instruction when executed by an operating device included in a pattern inspecting and measuring device performs a method for inspection or measurement of an inspection or measurement object pattern using a position of an edge extracted, with the use of an edge extraction parameter, from image data obtained by imaging the inspection or measurement object pattern, the method comprising: acquiring the image data of inspection or measurement target pattern, generating a brightness profile of the image data, at each position of multiple different positions on a reference pattern as a reference for the inspection or a measurement, in a direction intersecting with the edge of the reference pattern, defining an interval for extracting edge extraction parameter of the brightness profile with respect to the edge position of the different object pattern based on the edge of the reference pattern, setting the threshold value for each different position, depending on the difference of the position between the edge of the reference pattern in the defined range and the position that extracts from brightness profile, extracting a new edge for each different position from the brightness profile using a threshold value set for each different position of the object pattern, comparing the edge of the reference pattern and the pattern edge which generates based on the extraction of the new edge and the edge of the reference pattern, and outputting the comparison results.
This invention relates to a method for inspecting or measuring patterns, particularly in semiconductor or microfabrication processes, where precise edge detection is critical. The problem addressed is the variability in edge detection accuracy due to differences in brightness profiles across a pattern, which can lead to measurement errors. The solution involves a computer-implemented method that improves edge extraction by dynamically adjusting parameters based on a reference pattern. The method begins by acquiring image data of the target pattern. A brightness profile is generated from this data, and multiple positions on a reference pattern are analyzed in a direction intersecting the reference pattern's edge. For each position, an interval is defined for extracting edge parameters, and a threshold value is set based on the positional difference between the reference edge and the extracted edge from the brightness profile. This threshold is adjusted for each position to account for variations in the pattern's brightness profile. A new edge is then extracted for each position using the dynamically set threshold. The extracted edges are compared to the reference pattern's edges, and the results are outputted. This approach ensures consistent and accurate edge detection by adapting to local variations in the pattern's brightness, improving inspection and measurement reliability in high-precision applications.
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January 2, 2018
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