Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An electronic device comprising: a housing; a structure that is formed on a surface of the housing and comprises a first pattern having a first at least one through-hole; a first speaker that is arranged in an interior of the housing to be adjacent to a first portion of the first pattern and is configured to output a sound; a first microphone that is arranged in the interior of the housing to be adjacent to a second portion of the first pattern and is configured to receive a sound; a first member that is configured to contact at least one of the first speaker and the first microphone to fix at least one of the first speaker and the first microphone to the first member; and a second member that is arranged between the first member and the first pattern.
This invention relates to electronic devices with integrated audio components, specifically addressing the challenge of optimizing sound transmission and reception while maintaining structural integrity. The device includes a housing with a surface-mounted structure featuring a patterned design containing at least one through-hole. This pattern enhances acoustic performance by directing sound waves. A speaker is positioned inside the housing near a first section of the pattern to emit sound, while a microphone is placed adjacent to a second section to capture sound. The speaker and microphone are secured to a first member, which provides mechanical stability. A second member is positioned between the first member and the patterned structure to improve acoustic coupling and reduce vibrations. The through-holes in the pattern facilitate sound passage while maintaining structural support. This design ensures efficient sound transmission and reception while minimizing interference from internal components. The invention is particularly useful in compact devices where space constraints require integrated audio solutions.
2. The electronic device of claim 1 , wherein the structure comprises a transparent substrate.
3. The electronic device of claim 1 , wherein a peripheral area of the first at least one through-hole of the structure is chamfered.
This invention relates to electronic devices with improved structural designs for heat dissipation or component integration. The device includes a structure with at least one through-hole, where the peripheral area of the through-hole is chamfered. The chamfering reduces stress concentrations and improves manufacturing precision, particularly when the through-hole is used for mounting components or routing cables. The chamfered edge also facilitates easier insertion of fasteners or connectors, enhancing assembly efficiency. The structure may be part of a housing, bracket, or internal frame within the electronic device. The through-hole can be used for thermal management, such as allowing airflow or accommodating heat pipes, or for mechanical purposes, like securing circuit boards or other internal components. The chamfered design ensures smoother edges, reducing the risk of damage to cables or components during installation. This feature is particularly useful in compact electronic devices where space constraints require precise and efficient assembly. The chamfering process can be applied during machining or molding, depending on the material of the structure. The invention aims to improve durability, ease of manufacturing, and overall performance of electronic devices by optimizing the design of through-holes in structural components.
4. The electronic device of claim 1 , further comprising: a second pattern having a second at least one through-hole that passes through the surface on which the first pattern is formed or passes through another surface of the housing; and a second microphone that is arranged in the interior of the housing to be adjacent to the second pattern.
This invention relates to electronic devices with improved acoustic functionality, specifically addressing the challenge of optimizing microphone placement and sound transmission through device housings. The device includes a housing with a first pattern on one surface, where the pattern contains at least one through-hole that allows sound to pass through to a first microphone located inside the housing. The through-hole pattern is designed to enhance sound transmission while maintaining structural integrity. Additionally, the device incorporates a second pattern with at least one through-hole, either on the same surface as the first pattern or on a different surface of the housing. A second microphone is positioned inside the housing adjacent to this second pattern. The dual-pattern design enables the device to capture sound from multiple directions or surfaces, improving audio input flexibility and performance. The through-holes in both patterns are strategically placed to minimize visual obtrusiveness while ensuring effective sound transmission. This configuration is particularly useful in portable or compact electronic devices where space constraints limit microphone placement options. The invention enhances audio functionality without compromising the device's structural or aesthetic qualities.
5. The electronic device of claim 1 , further comprising: a second pattern having a second at least one through-hole that passes through the surface on which the first pattern is formed or passes through another surface of the housing; and a second speaker that is arranged in the interior of the housing to be adjacent to the second pattern.
This invention relates to electronic devices with improved acoustic performance, particularly for devices where sound output is constrained by structural design. The problem addressed is the limited sound projection and quality in devices with sealed or partially sealed housings, where traditional speaker placement and design can result in muffled or directional sound output. The device includes a housing with a first pattern on one surface, where the pattern contains at least one through-hole that allows sound to pass through. A first speaker is positioned inside the housing adjacent to this pattern, enabling sound to be emitted through the perforated surface. To enhance sound distribution, a second pattern with at least one through-hole is added, either on the same surface as the first pattern or on a different surface of the housing. A second speaker is placed inside the housing near this second pattern, allowing sound to be emitted from multiple locations. This dual-speaker, multi-pattern design improves sound projection, reduces distortion, and provides a more balanced audio experience by distributing sound output across different surfaces of the device. The through-holes in the patterns are designed to optimize sound transmission while maintaining structural integrity and aesthetic appeal.
6. The electronic device of claim 5 , further comprising: a control circuit that is electrically connected to the first microphone, the first speaker, and the second speaker, wherein the control circuit is configured to: when a call is received from an external device, output a voice of a counterpart of the received call using the first speaker, and output a sound based on a signal generated by the electronic device using the second speaker.
This invention relates to electronic devices with enhanced audio functionality for call handling. The device includes at least two speakers and a microphone, along with a control circuit that manages audio output during calls. When a call is received from an external device, the control circuit directs the voice of the caller to a first speaker while generating and outputting a distinct sound through a second speaker. The distinct sound may include system notifications, alerts, or other device-generated audio, ensuring clear separation between the caller's voice and device-generated sounds. This setup prevents audio interference and improves user experience by allowing simultaneous playback of different audio sources without overlap. The control circuit ensures proper routing of audio signals to the appropriate speakers, maintaining audio clarity and reducing distortion. The invention is particularly useful in devices where multiple audio outputs are required, such as smartphones, tablets, or smart speakers, to enhance call quality and user interaction.
7. The electronic device of claim 1 , wherein the second member is arranged to seal a space between the first member and the first pattern.
The invention relates to electronic devices with sealing mechanisms for protecting internal components. The problem addressed is preventing contamination, moisture, or other environmental factors from entering sensitive areas of an electronic device, particularly where a first member and a first pattern interface. The invention involves a second member positioned to create a sealed barrier between the first member and the first pattern, ensuring environmental protection. The first member and first pattern may be components such as circuit boards, housings, or other structural elements requiring isolation. The second member is designed to fit precisely between these components, forming a tight seal that prevents ingress of harmful substances. This sealing mechanism is critical for maintaining device reliability and longevity, especially in harsh operating conditions. The invention may be applied in consumer electronics, industrial equipment, or any device where environmental protection is necessary. The second member may be made of materials like rubber, silicone, or other flexible substances to ensure a durable and effective seal. The arrangement ensures that the sealed space remains isolated from external contaminants while allowing necessary electrical or mechanical connections to function properly. This solution improves device performance and reduces failure rates due to environmental exposure.
8. The electronic device of claim 1 , wherein at least a portion of the second member is formed of a material that is less solid than a material of the first member.
The invention relates to an electronic device with a housing structure designed to improve durability and impact resistance. The device includes a first member and a second member, where the second member is at least partially made of a material that is less solid than the material of the first member. This difference in material properties allows the second member to absorb impacts or deform more easily, reducing stress on the first member and preventing damage to internal components. The first member provides structural rigidity, while the second member acts as a protective or flexible interface. The design ensures that the device can withstand drops, bumps, or other physical stresses without compromising functionality. The materials used for the first and second members may include metals, plastics, or composites, with the second member being softer, more elastic, or otherwise less rigid than the first. This configuration is particularly useful in portable electronic devices like smartphones, tablets, or wearables, where impact resistance is critical. The invention addresses the problem of device fragility by incorporating a dual-material housing that balances strength and flexibility.
9. The electronic device of claim 8 , wherein the at least a portion of the second member comprises at least one of rubber or sponge.
This invention relates to an electronic device with a flexible or deformable component designed to improve durability, impact resistance, or user interaction. The device includes a first member and a second member, where at least a portion of the second member is made from rubber or sponge. These materials provide shock absorption, flexibility, or tactile feedback, enhancing the device's ability to withstand drops, vibrations, or repeated use. The second member may be a housing, cover, or internal structural element, and its deformable nature allows it to compress or bend without permanent damage. The rubber or sponge material may also improve grip, reduce noise during handling, or act as a seal against dust or moisture. The invention addresses the need for electronic devices that are more resilient to physical stress while maintaining functionality and user comfort. The use of rubber or sponge in the second member ensures that the device can absorb impacts, conform to uneven surfaces, or provide a softer touch interface compared to rigid materials. This design is particularly useful in portable electronics, wearable devices, or components exposed to frequent handling or environmental hazards.
10. The electronic device of claim 1 , wherein the first pattern comprises a plurality of through-holes, and wherein each of the plurality of through-holes are arranged at substantially a same interval.
This invention relates to electronic devices with patterned structures, specifically addressing the need for precise and uniform through-hole arrangements in components such as substrates, housings, or circuit boards. The invention improves manufacturing consistency and performance by ensuring that through-holes in a first pattern are evenly spaced at substantially the same interval. This uniformity enhances structural integrity, thermal management, and signal transmission in electronic devices. The through-holes may serve various functions, such as mechanical fastening, ventilation, or electrical interconnections. The arrangement ensures predictable mechanical properties and optimized airflow or signal pathways. The invention may be applied in printed circuit boards, semiconductor packaging, or other electronic assemblies where precise hole placement is critical. The uniform spacing minimizes stress concentrations and improves reliability under thermal or mechanical loads. The invention also allows for scalable manufacturing processes, as the consistent pattern facilitates automated drilling or etching techniques. This solution is particularly valuable in high-density electronic devices where precise alignment and spacing of through-holes are essential for functionality and durability.
11. The electronic device of claim 10 , wherein the plurality of through-holes formed in the first pattern are arranged in a matrix structure in which intervals between columns and rows of the matrix structure do not exceed a specific size.
This invention relates to electronic devices with improved thermal management through optimized through-hole arrangements. The problem addressed is inefficient heat dissipation in electronic devices, particularly those with high-density components, leading to overheating and reduced performance. The solution involves an electronic device with a housing that includes a plurality of through-holes arranged in a specific pattern to enhance airflow and heat dissipation. The through-holes are formed in a first pattern on the housing, where the pattern is designed to maximize cooling efficiency. The through-holes are arranged in a matrix structure, with intervals between columns and rows of the matrix not exceeding a specific size to ensure uniform heat dissipation across the device. This arrangement prevents localized overheating by distributing airflow evenly. The housing may also include additional through-holes in a second pattern, which may differ from the first pattern to further optimize cooling based on the device's thermal profile. The device may also include a heat sink or other cooling components integrated with the housing to work in conjunction with the through-hole patterns. The through-holes may be of varying sizes or shapes to accommodate different cooling requirements in different regions of the device. The overall design ensures that heat generated by internal components is effectively transferred to the external environment, maintaining optimal operating temperatures. This approach is particularly useful in high-performance electronic devices where thermal management is critical.
12. The electronic device of claim 1 , further comprising: a first printed circuit board that is arranged between the first surface and the second surface, wherein the first speaker and the first microphone are arranged on the first printed circuit board.
This invention relates to electronic devices with improved acoustic performance, particularly for devices requiring compact designs. The problem addressed is the challenge of integrating speakers and microphones in thin devices while maintaining audio quality and minimizing interference. The solution involves arranging a first printed circuit board (PCB) between two surfaces of the device, with a speaker and microphone mounted on this PCB. The PCB's placement ensures proper acoustic coupling while optimizing space utilization. The speaker and microphone are positioned to enhance sound transmission and reception, reducing distortion and feedback. The design may also include additional components on the PCB to support audio processing or connectivity. This configuration is particularly useful in portable electronics like smartphones, tablets, or wearables, where space constraints are critical. The invention improves audio functionality without increasing device thickness, addressing a key limitation in modern compact electronics.
13. The electronic device of claim 12 , further comprising: a second printed circuit board that is electrically connected to the first printed circuit board; and a control circuit that is arranged on the second printed circuit board and is electrically connected to the first speaker and the first microphone.
This invention relates to electronic devices with improved audio functionality, specifically addressing the need for compact, efficient audio signal processing and transmission between components. The device includes a first printed circuit board (PCB) with at least one speaker and one microphone mounted on it. A second PCB is electrically connected to the first PCB, housing a control circuit that manages audio signals. The control circuit is electrically connected to the speaker and microphone, enabling centralized control of audio input and output. This design allows for modular integration of audio components while maintaining signal integrity and reducing physical space requirements. The control circuit may include processing elements to enhance audio quality, such as noise reduction or signal amplification. The interconnected PCB structure facilitates efficient power distribution and signal routing, improving overall device performance. This configuration is particularly useful in portable or space-constrained electronic devices where compactness and reliable audio functionality are critical.
14. The electronic device of claim 1 , wherein the first at least one through-hole has a diameter of a specific size or less.
This invention relates to electronic devices with improved thermal management, particularly for devices that generate heat during operation. The problem addressed is the accumulation of heat in electronic components, which can degrade performance, reduce lifespan, and cause malfunctions. The invention provides an electronic device with a housing that includes at least one through-hole to facilitate heat dissipation. The through-hole is designed to allow heat to escape from the interior of the device to the exterior environment, thereby maintaining optimal operating temperatures. The through-hole is specifically sized to ensure effective heat dissipation while maintaining structural integrity and preventing ingress of dust, moisture, or other contaminants. The diameter of the through-hole is limited to a specific size or less to balance these competing factors. The device may include multiple through-holes arranged in a pattern to enhance heat dissipation efficiency. The housing may also incorporate additional features, such as fins or vents, to further improve thermal performance. The invention is particularly useful in compact electronic devices where space constraints limit traditional cooling solutions. By optimizing the size and placement of the through-holes, the device achieves efficient heat management without compromising durability or functionality.
15. A method of manufacturing an electronic device, the method comprising: mounting at least one speaker and at least one microphone on at least one surface of a bracket arranged inside the electronic device; punching at least one through-hole in a cover layer of the electronic device to form a pattern; connecting the cover layer that comprises the pattern to the bracket, wherein connecting the cover layer comprises arranging the pattern such that a first portion of the pattern is adjacent to the at least one speaker and a second portion of the pattern is adjacent to the at least one microphone; bringing a first member into contact with at least one of the at least one speaker and the at least one microphone to fix the at least one speaker and the at least one microphone with the first member; and arranging a second member between the first member and the pattern.
This invention relates to the manufacturing of electronic devices, specifically focusing on the integration of speakers and microphones within the device structure. The problem addressed involves optimizing the placement and acoustic performance of these components while ensuring structural integrity and efficient assembly. The method involves mounting at least one speaker and at least one microphone on a bracket inside the electronic device. A cover layer of the device is then punched to create a patterned through-hole, which is subsequently connected to the bracket. The pattern is aligned such that one portion is adjacent to the speaker and another portion is adjacent to the microphone, facilitating sound transmission and reception. A first member is then brought into contact with the speaker and/or microphone to secure them in place. Finally, a second member is positioned between the first member and the patterned cover layer to enhance structural stability and acoustic performance. This approach ensures precise alignment of acoustic components, improves sound quality, and simplifies the manufacturing process by integrating structural and functional elements in a single assembly. The method is particularly useful in devices where compact design and high-performance audio are critical.
16. The method of claim 15 , wherein punching the at least one through-hole comprises: punching the at least one through-hole such that the at least one through-hole has a diameter of a specific size or less.
This invention relates to a method for forming through-holes in a material, particularly in a metal sheet or plate, with precise control over the hole diameter. The method addresses the challenge of achieving consistent and accurate hole dimensions during punching operations, which is critical in manufacturing processes where tight tolerances are required. The technique involves punching at least one through-hole in the material, with the key innovation being the ability to limit the hole diameter to a specific size or smaller. This ensures that the resulting holes meet predefined dimensional specifications, reducing defects and improving product quality. The method may be applied in various industries, including automotive, aerospace, and electronics, where precise hole formation is essential for component assembly and functionality. By controlling the punching process to restrict the hole diameter, the invention enhances manufacturing precision and reliability, addressing common issues such as oversized holes or inconsistent dimensions that can arise from conventional punching techniques. The approach may be integrated into automated or manual punching systems, depending on the application requirements.
17. The method of claim 15 , wherein punching the at least one through-hole comprises: punching the at least one through-hole such that the at least one through-hole is arranged in a matrix form in which intervals between columns and rows of the matrix form do not exceed a specific size.
This invention relates to a method for forming through-holes in a material, particularly for applications requiring precise hole placement and spacing. The method addresses the challenge of creating through-holes in a structured arrangement where the spacing between adjacent holes is tightly controlled to meet specific design or functional requirements. The through-holes are punched in a matrix pattern, where the intervals between columns and rows of the matrix do not exceed a predefined size. This ensures uniformity and consistency in the hole distribution, which is critical for applications such as filtration, fluid flow management, or structural reinforcement. The method may involve punching multiple through-holes in a single operation or sequentially, depending on the material and tooling used. The predefined size for the intervals between holes is determined based on the intended application, ensuring optimal performance and structural integrity. This controlled spacing prevents excessive material stress or deformation while maintaining the desired functional properties of the punched material. The method is applicable to various materials, including metals, polymers, and composites, and can be adapted for different hole sizes and shapes.
18. The method of claim 15 , further comprising: pressing the second member to a lower side of the cover layer such that the second member seals a space between the first member and the pattern.
This invention relates to a method for sealing a space between a first member and a pattern in a layered structure. The method involves pressing a second member against a lower side of a cover layer to ensure a sealed interface. The first member and the pattern are positioned relative to each other, and the second member is used to apply pressure to the cover layer, effectively closing any gaps or spaces between the first member and the pattern. This sealing process prevents contamination, leakage, or misalignment in the assembly. The method is particularly useful in manufacturing processes where precise sealing is required, such as in electronic device fabrication, packaging, or other applications involving layered materials. The second member may be a flexible or rigid component, depending on the application, and the cover layer provides a protective or functional barrier. The sealing action ensures structural integrity and performance of the final assembly.
Unknown
January 9, 2018
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