Method for Manufacturing Housing

1. A method for manufacturing a housing of an electronic device containing at least one heat generating member, the housing comprising an etching area and an area not to be etched, comprising: shielding the area not to be etched by shielding ink; leaving the etching area exposed; forming a plurality of preset nano patterns in the etching area by nano-imprint or nanosphere lithography; etching the etching area and forming a plurality of heat dissipation holes of nanometer scale in the etching area; and cleaning the area not to be etched to remove the shielding ink; wherein the plurality of dissipation holes extends from an outer surface of the etching area toward the at least one heat-generating member, a cross-sectional shape of each dissipation hole is substantially perpendicular to an axis of the dissipation hole, and a plurality of echelons protrudes from an edge of a substantially circular dissipation area.

2. The manufacturing method of claim 1 , wherein the heat dissipation holes are blind holes.

3. The manufacturing method of claim 1 , wherein a hole diameter of each heat dissipation hole is from about 10 to 100 nanometers, the ratio of a diameter of each heat dissipation hole to a depth of each heat dissipation hole is in a range from about 1:2 to about 1:10.

4. The manufacturing method of claim 1 , wherein the heat dissipation holes are formed by chemical etching, or plasma etching, or reactive ion etching.

5. The manufacturing method of claim 1 , wherein the method further comprising cleaning the housing before shielding the area not to be etched and exposing the etching area.

6. The manufacturing method of claim 1 , wherein the shielding ink is selected from ultra violet curing ink and thermoset ink.

7. A method for manufacturing a housing of an electronic device containing at least one heat generating member, the housing comprising an etching area and an area not to be etched, comprising: shielding the area not to be etched by shielding ink and exposing the etching area; forming a plurality of preset nano patterns in the etching area by nano-imprint or nanosphere lithography; etching the etching area and forming a plurality of heat dissipation holes of nanometer scale in the etching area; and cleaning the area not to be etched to remove the shielding ink, wherein the plurality of heat dissipation holes is defined in an outer surface of a dissipation area, and each heat dissipation hole is in a nanometer scale, the plurality of heat dissipation holes is blind holes, a ratio of a diameter of each heat dissipation hole to a depth of each heat dissipation hole is in a range from about 1:2 to about 1:10, the plurality of heat dissipation holes extends from the outer surface toward the plurality of heat-generating members, a cross-sectional shape of each heat dissipation hole is substantially perpendicular to an axis of the dissipation hole, and a plurality of echelons protrudes from an edge of a substantially circular dissipation area.

8. The manufacturing method of claim 7 , wherein a hole diameter of each heat dissipation hole is from about 10 to 100 nanometers.

9. The manufacturing method of claim 7 , wherein the plurality of heat dissipation holes is formed by chemical etching, or plasma etching, or reactive ion etching.

10. The manufacturing method of claim 7 , wherein the method further comprising cleaning the housing before shielding the area not to be etched and exposing the etching area.

11. The manufacturing method of claim 7 , wherein the shielding ink is selected from ultra violet curing ink and thermoset ink.