Modular Electronic Device with Improved Retention/Release Features and Related Assembly Methods

1. A modular electronic device, comprising: a plurality of electronic modules, the plurality of electronic modules including a first electronic module, the first electronic module including a module housing; a frame defining a plurality of bays, the frame adapted to respectively receive the plurality of electronic modules at the plurality of bays, the plurality of bays including a first bay configured to receive the first electronic module; a fixed retention member associated with the frame; a release member associated with the module housing, the release member being movable relative to the retention member between a locked position, wherein the retention member is configured to engage the release member so as to retain the first electronic module within the first bay, and an unlocked position, wherein the release member is disengaged from the retention member; an electromechanical actuator provided in operative association with the release member for actuating the release member between the locked and unlocked positions; and an engagement detection circuit configured to provide an indication of whether the release member is located at the locked position relative to the retention member.

2. The modular electronic device of claim 1 , wherein the engagement detection circuit includes at least one ground member associated with the retention member and first and second conductive members associated with the release member, the electromechanical actuator including a first shape memory wire electrically coupled to the first conductive member and a second shape memory wire electrically coupled to the second conductive member, wherein, when the release member is at the locked position, the first and second conductive members electrically contact the at least one ground member to close the engagement detection circuit and, when the release member is moved from the locked position to the unlocked position, the first and second conductive members are moved away from the at least one ground member such that the engagement detection circuit is opened.

3. The modular electronic device of claim 2 , wherein each of the first and second shape memory wires extends between a first end coupled to its respective conductive member and a second end coupled to a current source.

4. The modular electronic device of claim 2 , wherein the at least one ground member comprises a first ground member configured to electrically contact the first conductive member and a second ground member configured to electrically contact the second conductive member.

5. The modular electronic device of claim 2 , wherein, when the release member is at the locked position, an engagement interface is defined between a first surface of the release member and a second surface of the retention member, the first and second conductive members being positioned at or adjacent to the first surface and the at least one ground member being positioned at or adjacent to the second surface such that an electrical connection is provided between the first and second conductive members and the at least one ground member at the engagement interface.

6. The modular electronic device of claim 5 , wherein at least a portion of the at least one ground member extends outwardly from the second surface in a release direction of the first electronic module such that the electrical connection is temporarily maintained across a distance defined in the release direction as the release member is moved away from the frame in the release direction.

7. The modular electronic device of claim 2 , wherein the first and second conductive members are positioned on the release member so as to be electrically isolated from one another.

8. The modular electronic device of claim 1 , wherein the engagement detection circuit includes a movable conductive member coupled to the release member, the movable conductive member being movable relative to a ground member of the engagement detection circuit as the release member is moved between the locked and unlocked positions.

9. The modular electronic device of claim 8 , wherein, when the release member is at the locked position, the movable conductive member is compressed between the release member and the retention member and electrically contacts the ground member to close the engagement detection circuit.

10. The modular electronic device of claim 9 , wherein, when the release member is moved from the locked position to the unlocked position, the movable conductive member moves away from the ground member such that the engagement detection circuit is opened.

11. The modular electronic device of claim 8 , wherein the ground member is coupled to the release member adjacent to the movable conductive member.

12. A method for assembling an electronic module configured for use with a modular electronic device, the method comprising: positioning a first shield component on a support surface; positioning a printed circuit board assembly on top of the first shield component such that the printed circuit board assembly is supported above the support surface; installing at least one actuator component of an electromechanical actuator relative to the printed circuit board assembly; and positioning a second shield component relative to the first shield component such that the printed circuit board assembly and the at least one actuator component are positioned between the first and second shield components.

13. The method of claim 12 , further comprising coupling the printed circuit board assembly to the first shield component prior to installing the at least one actuator component relative to the printed circuit board assembly.

14. The method of claim 12 , wherein the at least one actuator component includes a first shape memory wire and a second shape memory wire, each of the first and second shape memory wires extending lengthwise between a first end coupled to a release member of the electronic module and a second end opposite the first end.

15. The method of claim 14 , wherein installing the at least one actuator component relative to the printed circuit board assembly comprises: initially positioning the release member relative to the printed circuit board assembly; and moving the second end of each of the first and second shape memory wires away from the release member to tension the first and second shape memory wires.

16. The method of claim 15 , wherein a fixture component extends through an opening defined through the printed circuit board assembly, wherein initially positioning the release member relative to the printed circuit board assembly comprises positioning the release member relative to the printed circuit board assembly such that the release member engages a portion of the fixture component extending through the opening.

17. The method of claim 15 , wherein the second end of each of the first and second shape memory wires is coupled to a contactor configured to be separately coupled to the printed circuit board assembly.

18. The method of claim 12 , further comprising coupling the second shield component to the first shield component.

19. The method of claim 12 , further comprising mounting one or more internal components of the electronic module to a printed circuit board to form the printed circuit board assembly.

20. The method of claim 12 , wherein the printed circuit board assembly includes a first printed circuit board and a second printed circuit board.

21. The method of claim 20 , further comprising coupling the first printed circuit board to the second printed circuit board prior to positioning the printed circuit board assembly on top of the first shield component.

22. The method of claim 21 , wherein the first and second printed circuit boards are coupled together via a flexible printed circuit.

23. A method for assembling an electronic module configured for use with a modular electronic device, the method comprising: positioning a first shield component on a support surface; positioning a printed circuit board assembly on top of the first shield component such that the printed circuit board assembly is supported above the support surface, the printed circuit board assembly including a printed circuit board and at least one internal component of the electronic module mounted to the printed circuit board; and positioning a second shield component relative to the first shield component such that the printed circuit board assembly is encased between the first and second shield components.

24. The method of claim 23 , wherein the printed circuit board defines a slot configured to be aligned with a corresponding opening defined through one of the first shield component or the second shield component when the printed circuit board assembly is encased between the first and second shield components.