Patentable/Patents/RE47151
RE47151

Assembly of an Electronic Device Casing, a Heat-Dissipating Module and a Waterproofing Module, Waterproofing Module, and Electronic Device

PublishedDecember 4, 2018
Assigneenot available in USPTO data we have
InventorsPo-Yuan HsuWei-Cheng WangChen-Yu LiHsing-Wang ChangTsung-Hsien Chen+1 more
Technical Abstract

Patent Claims

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Patent Metadata

Filing Date

Unknown

Publication Date

December 4, 2018

Inventors

Po-Yuan Hsu
Wei-Cheng Wang
Chen-Yu Li
Hsing-Wang Chang
Tsung-Hsien Chen
Chia-Cheng Su

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Cite as: Patentable. “ASSEMBLY OF AN ELECTRONIC DEVICE CASING, A HEAT-DISSIPATING MODULE AND A WATERPROOFING MODULE, WATERPROOFING MODULE, AND ELECTRONIC DEVICE” (RE47151). https://patentable.app/patents/RE47151

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