LED module

1. A LED module comprising: at least one LED chip including a sub-mount substrate and a semiconductor layer laminated on the sub-mount substrate, the sub-mount substrate being made of Si, the sub-mount substrate being larger in length in a direction perpendicular to a thickness direction of the sub-mount substrate than the semiconductor layer; opaque resin that does not transmit light from the semiconductor layer; wherein the sub-mount substrate includes a side connected to a surface on which the semiconductor layer is laminated, and the opaque resin covers at least part of the side of the sub-mount substrate; and a reflector having a reflective surface surrounding the LED chip, wherein the semiconductor layer has a first surface and a second surface, the second surface being positioned closer to the sub-mount substrate than the first surface, the sub-mount substrate, a lower portion of the reflective surface and an entirety of the opaque resin are disposed on a same side of a plane containing the second surface of the semiconductor layer, the LED module comprises a base substrate and a first wire, the base substrate including a base member and a wiring pattern, the wiring pattern includes a first bonding portion and a second bonding portion spaced apart from the first bonding portion, the LED chip being bonded to the first bonding portion, the first wire being bonded to the sub-mount substrate and the second bonding portion, and the opaque resin is disposed on the first bonding portion and spaced apart from the second bonding portion, the opaque resin is spaced apart from the lower portion of the reflective surface, and the opaque resin has a continuously curved surface descending gradually toward the first bonding portion, and the continuously curved surface of the opaque resin is outwardly convex.

2. The LED module according to claim 1 , wherein the opaque resin is white.

3. The LED module according to claim 1 , wherein the opaque resin covers the entirety of the side of the sub-mount substrate while exposing the semiconductor layer.

4. The LED module according to claim 1 , wherein the sub-mount substrate is formed with a Zener diode for preventing an excessive reverse voltage from being applied to the semiconductor layer.

5. The LED module according to claim 4 , wherein the semiconductor layer is configured to emit blue light or green light.

6. The LED module according to claim 1 , further comprising a second wire bonded to the sub-mount substrate and the first bonding portion of the wiring pattern, wherein the opaque resin is out of contact with the first and second wires.

7. The LED module according to claim 1 , wherein the sub-mount substrate includes another surface opposite from the surface on which the semiconductor layer is laminated, said another surface being electrically connected to the wiring pattern.

8. The LED module according to claim 1 , wherein the sub-mount substrate includes another surface opposite from the surface on which the semiconductor layer is laminated, said another surface being provided with two electrode pads, and the electrode pads are electrically connected to the wiring pattern.

9. The LED module according to claim 1 , further comprising: sealing resin that covers the LED chip and transmits light from the LED chip, wherein the reflector is attached to the base substrate, and at least a part of the reflective surface other than the lower portion is exposed from the opaque resin.

10. The LED module according to claim 1 , further comprising sealing resin provided on the base substrate, wherein the sealing resin covers the LED chip and transmits light from the LED chip.

11. The LED module according to claim 1 , wherein the first bonding portion includes a main part supporting the LED chip and an auxiliary part extending from the main part in a first direction, and wherein the second bonding portion overlaps with the main part of the first bonding portion as viewed in the first direction and also overlaps with the auxiliary part of the first bonding portion as viewed in a second direction perpendicular to the first direction.

12. The LED module according to claim 11 , wherein the main part of the first bonding portion is greater in size in the second direction than the auxiliary part of the first bonding portion.

13. The LED module according to claim 12 , wherein the auxiliary part of the first bonding portion has a portion exposed from the opaque resin.

14. The LED module according to claim 12 , wherein the main part and the auxiliary part of the first bonding portion have respective edges that are flush with each other in the first direction.

15. The LED module according to claim 1 , wherein the opaque resin is disposed only on the first bonding portion.

16. A LED module comprising: a member formed with a recess having a bottom surface and a side wall; an electrical conductor that includes a first lead disposed on the bottom surface of the recess; a LED chip disposed on the first lead, the LED chip including an active layer; a first insulating material that surrounds the LED chip and is spaced apart from the side wall of the recess in plan view, the first insulating material reflecting light emitted from the LED chip; and a wire including a first end and a second end that are spaced apart from each other in a longitudinal direction of the wire, the first end of the wire being bonded to the electrical conductor, the second end of the wire being bonded to the LED chip at a location, the location being spaced apart from the active layer of the LED chip in plan view, wherein the first insulating material has a continuously curved surface descending gradually toward the first lead, and the continuously curved surface of the first insulating material is outwardly convex, and the LED chip comprises a semiconductor layer and a substrate disposed between the semiconductor layer and the first lead, wherein the substrate has an obverse surface and a side surface, the semiconductor layer being disposed on the obverse surface of the substrate, the first insulating material being in close contact with the side surface of the substrate, and the active layer is formed by the semiconductor layer, the substrate including a portion that is larger in length in a direction perpendicular to a thickness direction of the substrate than the active layer of the semiconductor layer.

17. The LED module according to claim 16 , wherein the first lead is electrically connected to the LED chip.

18. The LED module according to claim 16 , wherein the first insulating material is disposed only on the first lead in plan view.

19. The LED module according to claim 16 , wherein the electrical conductor includes a second lead disposed on the bottom surface of the recess and spaced apart from the first lead.

20. The LED module according to claim 19 , wherein the first insulating material is spaced apart from the second lead in plan view.

21. The LED module according to claim 16 , wherein the first insulating material is white.

22. The LED module according to claim 19 , wherein the wire electrically connects the LED chip to the second lead.

23. The LED module according to claim 16 , further comprising a second insulating material disposed in the recess of the support member, wherein the second insulating material allows passage of the light emitted from the LED chip.

24. A LED module comprising: a member; an electrical conductor that includes a first lead disposed on a surface of the member; a LED chip disposed on the first lead and comprising an active layer; a first insulating material that surrounds the LED chip in plan view and reflects light emitted from the LED chip; and a second insulating material disposed on the surface of the member and held in contact with both the LED chip and the first lead; and a wire including a first end and a second end that are spaced apart from each other in a longitudinal direction of the wire, the first end of the wire being bonded to the electrical conductor, the second end of the wire being bonded to the LED chip at a location, the location being spaced apart from the active layer of the LED chip in plan view, wherein the first insulating material is overlapped by the second insulating material in plan view and spaced apart from at least a part of an outer periphery of the second insulating material in plan view, the first insulating material has a continuously curved surface descending gradually toward the first lead, and the continuously curved surface of the first insulating material is outwardly convex, and the LED chip comprises a semiconductor layer and a substrate disposed between the semiconductor layer and the first lead, wherein the substrate has an obverse surface and a side surface, the semiconductor layer being disposed on the obverse surface of the substrate, the first insulating material being in close contact with the side surface of the substrate, the active layer is formed by the semiconductor layer, the substrate including a portion that is larger in length in a direction perpendicular to a thickness direction of the substrate than the active layer of the semiconductor layer.

25. The LED module according to claim 24 , wherein the first lead is electrically connected to the LED chip.

26. The LED module according to claim 24 , wherein the first insulating material is disposed only on the first lead in plan view.

27. The LED module according to claim 24 , wherein the electrical conductor includes a second lead disposed on the surface of the member and spaced apart from the first lead.

28. The LED module according to claim 27 , wherein the first insulating material is spaced apart from the second lead in plan view.

29. The LED module according to claim 24 , wherein the first insulating material is white.

30. The LED module according to claim 27 , wherein the wire electrically connects the LED chip to the second lead.

31. The LED module according to claim 24 , wherein the second insulating material allows passage of the light emitted from the LED chip.