Embodiments include devices and methods for detecting particles in a wafer processing tool. In an embodiment, a particle monitoring device having a wafer form factor includes several micro sensors capable of operating in all pressure regimes, e.g., under vacuum conditions. The particle monitoring device may include a clock to output a time value when a parameter of a micro sensor changes in response to receiving a particle within a chamber of the wafer processing tool. A location of the micro sensor or the time value may be used to determine a source of the particle. Other embodiments are also described and claimed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A particle monitoring device, comprising: a substrate having a support surface; a micro sensor mounted at a predetermined location on the support surface, wherein the micro sensor has a parameter, and wherein the parameter changes when the micro sensor receives a particle within a chamber of a wafer processing tool; a clock mounted on the substrate, wherein the clock is configured to output a time value; an accelerometer coupled directly to the clock, the accelerometer to trigger the clock to begin outputting a time value when the particle monitoring device enters or exits a chamber or a load lock of a wafer processing tool; a processor mounted on the substrate, wherein the processor is operably coupled to the micro sensor and the clock, and wherein the processor is configured to record the predetermined location and the time value when the parameter of the micro sensor changes.
2. The particle monitoring device of claim 1 further comprising a memory mounted on the substrate, wherein the processor is operably coupled to the memory to record the predetermined location and the time value in the memory.
3. The particle monitoring device of claim 2 further comprising a power source mounted on the substrate, wherein the power source is electrically coupled to one or more of the micro sensor, the clock, the processor, or the memory to power the one or more of the micro sensor, the clock, the processor, or the memory.
4. The particle monitoring device of claim 1 , wherein the substrate includes a semiconductor material having a wafer form factor.
5. The particle monitoring device of claim 4 , wherein the wafer form factor includes a diameter between 95 to 455 mm.
6. The particle monitoring device of claim 1 , wherein the micro sensor includes: a MOSFET, wherein the parameter is a threshold voltage of the MOSFET, and a collector electrically coupled to the MOSFET, wherein the threshold voltage changes in response to the particle contacting the collector.
7. The particle monitoring device of claim 1 , wherein the micro sensor includes an optical sensor having an optical path, and wherein the parameter changes in response to the particle disturbing the optical path.
8. A particle monitoring device, comprising: a substrate having a support surface; a micro-resonator mounted at a predetermined location on the support surface, wherein the micro-resonator has a characteristic frequency, and wherein the characteristic frequency shifts when the micro-resonator receives a particle within a chamber of a wafer processing tool; a clock mounted on the substrate, wherein the clock is configured to output a time value; a processor mounted on the substrate, wherein the processor is operably coupled to the micro-resonator and the clock, and wherein the processor is configured to record the predetermined location and the time value when the characteristic frequency of the micro-resonator shifts; and a broad frequency source mounted on the substrate to excite the micro-resonator.
9. The particle monitoring device of claim 8 , wherein the characteristic frequency is inversely proportional to a mass of the micro-resonator, and wherein the mass of the micro-resonator changes when the micro-resonator receives the particle.
10. The particle monitoring device of claim 8 further comprising a detector mounted on the substrate to detect the shift of the characteristic frequency.
11. The particle monitoring device of claim 10 further comprising a memory mounted on the substrate, wherein the processor is operably coupled to the memory to record the predetermined location and the time value in the memory.
12. The particle monitoring device of claim 11 further comprising a power source mounted on the substrate, wherein the power source is electrically coupled to one or more of the micro-resonator, the clock, the processor, or the memory to power the one or more of the micro-resonator, the clock, the processor, or the memory.
13. The particle monitoring device of claim 8 , wherein the substrate includes a semiconductor material having a wafer form factor.
14. The particle monitoring device of claim 13 , wherein the wafer form factor includes a diameter between 95 to 455 mm.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 6, 2015
September 4, 2018
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