A photoelectric conversion assembly is proposed. The photoelectric conversion module comprises three parts, photoelectric conversion module, a printed circuit board (PCB) and a hybrid cable. The photoelectric conversion module comprises an interposer, at least one optical element configured on the interposer, and an optical bench for the printed circuit board and the interposer configured thereon. Electrical wires are used for coupling to the printed circuit board. An optical ferrule is used for engaging with the photoelectric conversion module and an optical fiber component. A plug is used for electrically connecting the printed circuit board. A first lens array is configured under the interposer. A mirror is configured under the first lens array. A second lens array is configured left side of the mirror.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A structure of photoelectric conversion assembly, comprising: a photoelectric conversion module; a printed circuit board for coupling to said photoelectric conversion module; electrical wires for coupling to said printed circuit board; an optical fiber component for transmitting light; an optical ferrule for engaging with said photoelectric conversion module and said optical fiber component; and a plug for electrically connecting said printed circuit board; wherein structure of said photoelectric conversion module comprises: a circuit board having conductive trace formed thereon; at least one optical element flip-chip mounted on said circuit board and coupled to said conductive trace on said circuit board; an optical bench having a first concave portion and a second concave portion, wherein front side of said printed circuit board is disposed on said first concave portion at two sides of said optical bench, and said circuit board is embedded within said second concave portion of said optical bench to reduce height of said structure of photoelectric conversion assembly; and wire bond pads of said printed circuit board are electrically connected to said conductive trace of said circuit board by wire bonding.
2. The structure of claim 1 , wherein said photoelectric conversion module further comprises: a first lens array configured under said circuit board to align said at least one optical element; a mirror configured under said first lens array; and a second lens array configured left side of said mirror.
3. The structure of claim 1 , wherein said circuit board has a through hole passing through a top surface of said circuit board to a bottom surface of said circuit board.
4. The structure of claim 2 , wherein said circuit board is attached on said second concave portion of said optical bench by using an adhesive material.
5. The structure of claim 2 , wherein arrangement orientation of said first lens array is the same as said second lens array.
6. The structure of claim 2 , wherein said first lens array, said second lens array and said mirror are embedded into said optical bench.
7. The structure of claim 2 , wherein said at least one optical element is a light source chip, a photo diode chip, a photo detector chip or a photosensitive chip.
8. The structure of claim 2 , further comprising a conductive trace formed on said circuit board to couple said at least one optical element.
9. The structure of claim 2 , further comprising at least one IC formed on said circuit board.
10. The structure of claim 2 , wherein a size of said circuit board is less than or equal to that of said second concave portion of said optical bench.
11. The structure of claim 2 , further comprising a guide pin for engaging said optical ferrule with said optical bench.
12. The structure of claim 2 , wherein said circuit board has a through hole passing through a top surface of said circuit board to a bottom surface of said circuit board.
13. The structure of claim 1 , wherein said circuit board further includes an optical waveguide portion and V-shape trench; and wherein said optical bench includes a lens array configured to align said optical waveguide portion.
14. The structure of claim 13 , further comprising at least one IC formed on said circuit board.
15. The structure of claim 13 , wherein said circuit board is attached on said second concave portion of said optical bench by using an adhesive material.
16. The structure of claim 15 , wherein a size of said circuit board is less than or equal to that of said second concave portion of said optical bench.
17. The structure of claim 13 , wherein said at least one optical element is a light source chip, a photo diode chip, a photo detector chip or a photosensitive chip.
18. The structure of claim 13 , further comprising a conductive trace formed on said circuit board to couple said at least one optical element.
19. The structure of claim 13 , further comprising a guide pin for engaging said optical ferrule with said optical bench.
20. The structure of claim 13 , wherein a size of said circuit board is less than or equal to that of said second concave portion of said optical bench.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 4, 2016
September 4, 2018
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