Semiconductor device and manufacturing method thereof

1. A manufacturing method of a semiconductor device comprising: a die bonding step of bonding a semiconductor element to a die pad of a lead frame which includes a plurality of circuit patterns which each have said die pad and an electrode terminal portion provided around said die pad and are disposed in a band shape; a tie bar which connects a plurality of electrode terminals configuring said electrode terminal portion and extends in a disposition direction of said circuit patterns; a frame portion which has a partition frame between said circuit patterns, is connected to said plurality of electrode terminals and both end portions of said tie bar and is arranged so as to surround said circuit patterns; and a suspension lead which connects said frame portion and said die pad in the disposition direction of said circuit patterns; a wire bonding step of electrically connecting said semiconductor element and said plurality of electrode terminals by a metal wire; a lead forming step of cutting a connection portion between end portions of said plurality of electrode terminals and said frame portion, a connection portion between said frame portion and said tie bar at both end portions in the disposition direction of said circuit patterns, and a connection portion from a connection part of said frame portion with said tie bar, the part being between said circuit patterns, to a part of said frame portion extending in the disposition direction of said circuit patterns, and bending a part of said electrode terminal portion between said tie bar and said die pad to make an end portion of said electrode terminal portion including said tie bar extend in a direction to which an upper surface of said semiconductor element faces; a resin sealing step of sealing said lead frame with a resin so that a part of said electrode terminal portion, the part being positioned above said tie bar in the direction to which the upper surface of said semiconductor element faces, and said tie bar are exposed; and a lead cutting step of cutting between said circuit patterns to be separated into the individual semiconductor device.

2. The manufacturing method of a semiconductor device according to claim 1 , wherein at said resin sealing step, the lead frame subjected to said lead forming step is arranged inside a metal mold, a part exposed to the outside of said metal mold through a terminal hole is clamped by a movable clamp to hold a part including said tie bar, the terminal hole being provided in an upper portion of said metal mold and having a rectangular opening extending in the disposition direction of said circuit patterns, and a front end portion of said movable clamp is engaged in said terminal hole.

3. The manufacturing method of a semiconductor device according to claim 1 , wherein said suspension lead is provided with a step parallel to a direction orthogonal to the disposition direction of said circuit patterns.

4. The manufacturing method of a semiconductor device according to claim 1 , wherein said suspension lead has a thickness of 0.4 to 0.7 mm and a width of 10 to 20 mm in a direction orthogonal to the disposition direction of said circuit patterns.

5. The manufacturing method of a semiconductor device according to claim 1 , wherein the resin has an upper exposed surface that extends over said lead frame; and said electrode terminal portion of said lead frame protrudes from the upper exposed surface of said resin after said lead frame is sealed with said resin during the resin sealing step.

6. The manufacturing method of a semiconductor device according to claim 1 , wherein said electrode terminal portion includes a bent portion that directs said electrode terminal portion to protrude from the upper exposed surface of said resin.

7. A manufacturing method of a semiconductor device comprising: a die bonding step of bonding a semiconductor element to a die pad of a lead frame which includes a plurality of circuit patterns which each have said die pad and an electrode terminal portion provided around said die pad and are disposed in a band shape; a frame portion arranged so as to connect with said electrode terminal portion and surround said electrode terminal portion and said die pad; and a suspension lead which connects said frame portion and said die pad; a wire bonding step of electrically connecting said semiconductor element and said electrode terminal portion by a metal wire; a lead forming step of cutting a connection part between said electrode terminal portion and said frame portion and bending said electrode terminal portion to extend in a direction to which an upper surface of said semiconductor element faces; a resin sealing step of sealing said lead frame with a resin so that a part of said electrode terminal portion is exposed, the part being positioned in the direction to which the upper surface of said semiconductor element faces; and a lead cutting step of cutting between said circuit patterns to be separated into the individual semiconductor device.

8. The manufacturing method of a semiconductor device according to claim 7 , wherein at said resin sealing step, the lead frame subjected to said lead forming step is arranged inside a metal mold, a part exposed to the outside of said metal mold through a terminal hole is clamped by a movable clamp to hold a part including said tie bar, the terminal hole being provided in an upper portion of said metal mold and having a rectangular opening extending in the disposition direction of said circuit patterns, and a front end portion of said movable clamp is engaged in said terminal hole.

9. The manufacturing method of a semiconductor device according to claim 7 , wherein said suspension lead is provided with a step parallel to a direction orthogonal to a disposition direction of said circuit patterns.

10. The manufacturing method of a semiconductor device according to claim 7 , wherein the resin has an upper exposed surface that extends over said lead frame; and said electrode terminal portion of said lead frame protrudes from the upper exposed surface of said resin after said lead frame is sealed with said resin during the resin sealing step.

11. The manufacturing method of a semiconductor device according to claim 7 , wherein said electrode terminal portion includes a bent portion that directs said electrode terminal portion to protrude from the upper exposed surface of said resin.

12. A semiconductor device comprising: a lead frame having a die pad bonded to a back surface of a semiconductor element and covered with a single resin along with said semiconductor element, the single resin having an upper exposed surface that extends over the lead frame; wherein an electrode terminal portion of said lead frame is configured to protrude from the upper exposed surface of said resin to extend in a direction to which a top surface of said semiconductor element faces.

13. The semiconductor device according to claim 12 , wherein the electrode terminal portion includes a bent portion covered by said resin that directs the electrode terminal portion to protrude from the upper exposed surface of said resin.

14. The semiconductor device according to claim 12 , further comprising a circuit pattern that extends in a disposition direction on said lead frame; and a suspension lead which connects said lead frame and said die pad; and wherein said suspension lead is provided with a step parallel to a direction orthogonal to the disposition direction of said circuit pattern.