The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).
Legal claims defining the scope of protection, as filed with the USPTO.
2. The curable resin composition according to claim 1 , wherein a content of a cyclic organosiloxane having a molecular weight of 150 to 1,200 is 7.5 mass % or less.
3. The curable resin composition according to claim 1 , wherein the average degree of polymerization of the straight-chain organopolysiloxane (A) is greater than 30.
5. The curable resin composition according to claim 1 , wherein the composition is a composition for sealing an optical semiconductor element.
6. The curable resin composition according to claim 2 , wherein the average degree of polymerization of the straight-chain organopolysiloxane (A) is greater than 30.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 25, 2014
October 16, 2018
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