A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A module, comprising: an electronic component having a first electrode; a mounting board having a second electrode; a solder-bump configured to connect the first electrode and the second electrode; and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
2. The module according to claim 1 , wherein a glass-transition temperature of the resin member is lower than a melting point of the solder-bump.
3. The module according to claim 2 , wherein the second electrode is not exposed to the space.
4. The module according to claim 2 , wherein: the solder-bump is a first solder-bump; the electronic component further comprises a third electrode; the mounting board further comprises a fourth electrode; the module further comprises a second solder-bump that connects the third electrode and the fourth electrode; and the space is positioned between the first solder-bump and the second solder-bump.
5. The module according to claim 4 , wherein the resin member is a first resin member; the module further comprises a second thermoplastic resin member that contacts both the third electrode and the fourth electrode, and covers the second solder-bump; and the first resin member and the second resin member do not contact each other.
6. The module according to claim 2 , wherein: the electronic component is an image sensor; the electronic component includes, in a plan view in relation to a surface opposite to the mounting board, a capture area that forms an image capturing surface and a peripheral area thereof; and the first electrode is arranged in the peripheral area.
7. The module according to claim 2 , wherein: the electronic component has: a semiconductor device; an opposing board arranged on a side opposite to a side of the mounting board in relation to the semiconductor device so as to be opposing the semiconductor device; and a coupling member configured to couple the semiconductor device and the opposing board so as to form a space between the semiconductor device and the opposing board, and wherein the coupling member is arranged so as to overlap the first electrode in the plan view.
8. The module according to claim 7 , wherein the semiconductor device is connected to the first electrode and has a through electrode that penetrates the semiconductor board of the semiconductor device.
9. The module according to claim 2 , wherein the resin member includes at least one of an acrylic resin, a polyimide resin, a polyolefin resin, a polybutadiene resin, a novolac resin, and a fluororesin.
10. An electronic device, comprising: a module; and a processor configured to process a signal from the module, wherein the module comprises: an electronic component having a first electrode; a mounting board having a second electrode; a solder-bump configured to connect the first electrode and the second electrode; and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump so as to form a space between the electronic component and the mounting board, and wherein a glass-transition temperature of the resin member is lower than a melting point of the solder-bump.
11. A method for manufacturing a module, comprising: preparing an electronic component having a first electrode; forming a solder-bump on the first electrode; forming a thermoplastic resin member so that the resin member contacts the first electrode, and exposes the solder-bump; preparing a mounting board having a second electrode; and electrically connecting the first electrode and the second electrode by heating the solder-bump in a state in which the solder-bump is positioned between the first electrode and the second electrode, wherein in the heating, the resin member contacts both the first electrode and the second electrode while covering the solder-bump, so as to form a space between the electronic component and the mounting board.
12. The method according to claim 11 , wherein the resin member covers the solder-bump in the forming of the resin member.
13. The method according to claim 11 , further comprising detaching the electronic component from the mounting board by heating the resin member and the solder-bump, wherein a glass-transition temperature of the resin member is lower than a melting point of the solder-bump.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 19, 2017
October 30, 2018
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