Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A light emitting device comprising: a plurality of lead frames; a light emitting chip on at least one of the plurality of lead frames; a first body disposed on the plurality of lead frames; a second body disposed on the first body; a gap part between the plurality of lead frames; and a first transmissive layer disposed on the light emitting chip, wherein the light emitting chip is electrically connected to the plurality of lead frames, wherein the first body has an open region, wherein the second body has a first opening overlapped with the open region of the first body, wherein the light emitting chip is disposed in the first opening of the second body, wherein a top surfaces of the plurality of lead frames are exposed on the first opening of the second body, wherein the first body includes a non-transmissive resin material, wherein the second body includes a transmissive resin material, wherein the first body and the second body are disposed around the light emitting chip, wherein the first body is overlapped with the second body around the light emitting chip in a vertical direction, wherein a first region of the second body is disposed between the light emitting chip and the first body on the plurality of lead frames, and wherein the first body and the second body are not overlapped with a top surface of the light emitting chip in the vertical direction.
2. The light emitting device of claim 1 , wherein the first body and the second body contact the top surfaces of the plurality of lead frames.
3. The light emitting device of claim 1 , wherein an inner region of the first body is spaced apart from the first transmissive layer.
4. The light emitting device of claim 1 , wherein the second body contacts a top surface of the first body.
5. The light emitting device of claim 1 , wherein a bottom surface of the first region of the second body has a height lower than a height of a top surface of the light emitting chip.
6. The light emitting device of claim 1 , wherein the first region of the second body is disposed to be closer to the light emitting chip than to the first body.
7. The light emitting device of claim 1 , wherein the second body has a thickness thicker than a thickness of the first body which is disposed on the top surfaces of the plurality of lead frames.
8. The light emitting device of claim 1 , wherein a top surface of the first body is angled relative to the light emitting chip.
9. A light emitting device comprising: a plurality of lead frames having a first lead frame and a second lead frame; a light emitting chip on at least one of the first lead frame and the second lead frame; a first body disposed on the first lead frame and the second lead frame; a second body disposed on the first body; a gap part between the first lead frame and the second lead frame; a first transmissive layer disposed on the light emitting chip; and a protective device on one of the first lead frame and the second lead frame, wherein the light emitting chip is electrically connected to the plurality of lead frames, wherein the first body has an open region, wherein the second body has a first opening in the open region of the first body, wherein the first opening of the second body has a width smaller than a width of the open region of the first body, wherein the light emitting chip is disposed in the first opening of the second body, wherein a top surfaces of the first lead frame and the second lead frame are exposed on the first opening of the second body, wherein the first body includes a non-transmissive resin material, wherein the second body includes a transmissive resin material, wherein the first body and the second body are disposed around the light emitting chip, wherein the first body is overlapped with the second body around the light emitting chip in a vertical direction, wherein a first region of the second body is disposed between the light emitting chip and the first body on the plurality of lead frames, wherein the first transmissive layer is spaced apart from the first body on the top surfaces of the first lead frame and the second lead frame and contacts the second body, wherein the protective device is disposed in a second opening of the second body, wherein the second opening of the second body is spaced apart from the first opening, and wherein the first body and the second body are disposed between the first opening and the second opening.
10. The light emitting device of claim 9 , wherein the first body includes an inner region adjacent to the light emitting chip and an outer region which has a thickness thicker than a thickness of the inner region.
11. The light emitting device of claim 10 , wherein a top surface of the inner region of the first body is inclined at an angle of 65° to 89° about a line perpendicular to the light emitting chip.
12. The light emitting device of claim 9 , wherein a top surface of the first body has a height lower than a height of a top surface of the light emitting chip.
13. The light emitting device of claim 9 , wherein the gap part is disposed under the open region of the first body and the first opening of the second body.
14. The light emitting device of claim 9 , wherein a bottom surface of the gap part has a width wider than that of a top surface of the gap part.
15. The light emitting device of claim 9 , wherein the second body includes the first region being closer to the light emitting chip than the first body disposed on the first lead frame and the second lead frame.
16. The light emitting device of claim 9 , wherein a top surface of the first body is angled relative to the light emitting chip.
17. The light emitting device of claim 9 , further comprising a phosphor layer on the light emitting chip.
18. The light emitting device of claim 9 , further comprising an optical lens disposed on the first transmissive layer, wherein the optical lens includes a concave part having an upper center concave toward the light emitting chip.
19. The light emitting device of claim 1 , wherein the first body includes a silicon material or an epoxy resin material, wherein the second body includes a transmissive silicon material or a transmissive epoxy resin material, and wherein the first body includes at least one of TiO 2 , SiO 2 or Al 2 O 3 .
20. The light emitting device of claim 9 , wherein the first body includes a silicon material or an epoxy resin material, wherein the second body includes a transmissive silicon material or a transmissive epoxy resin material, and wherein the first body includes at least one of TiO 2 , SiO 2 or Al 2 O 3 .
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 27, 2015
November 13, 2018
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