Power-module substrate with cooler and method of producing the same

1. A method of producing a power-module substrate with cooler comprising a first bonding step of forming a circuit layer by bonding a metal plate made of copper or copper alloy on one surface of a ceramic board and forming a first metal layer by bonding a metal plate made of copper or copper alloy on the other surface of the ceramic board; a second bonding step of forming a second metal layer by bonding a metal plate made of nickel or nickel alloy on the first metal layer by solid-phase diffusion bonding; and a third bonding step of brazing a cooler made of aluminum alloy on the second metal layer with Al-based Mg-included brazing material; wherein the second bonding step is carried out simultaneously with the first bonding step.

2. The method of producing a power-module substrate with cooler according to claim 1 , wherein in the second bonding step, with inserting a titanium foil between the first metal layer and the second metal layer, the first metal layer and the titanium foil, and the second metal layer and the titanium foil are bonded respectively by the solid-phase diffusion, and in the third bonding step, with Al—Si—Mg-based brazing material, the second metal layer and the cooler are brazed.

3. The method of producing a power-module substrate with cooler according to claim 2 , wherein an area of the titanium foil is larger than that of the first metal layer.

4. The method of producing a power-module substrate with cooler according to claim 1 , wherein an area of the second metal layer is larger than that of the first metal layer.

5. The method of producing a power-module substrate with cooler according to claim 1 , wherein in the second bonding step, an aluminum plate is further stacked on the second metal layer, and the first metal layer and the second metal layer, and the second metal layer and the aluminum plate are bonded respectively by solid-phase diffusion bonding.