Patentable/Patents/US-10269719
US-10269719

Multilevel light emitting LED substrate, package and bulb

PublishedApril 23, 2019
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A multilevel light emitting LED substrate and package, and bulb, comprising multiple annular substrates disposed at intervals, wherein every two adjacent annular substrates among the multiple annular substrates are connected by using at least one connection part, and the the connection part is stretched and shaped such that the multiple annular substrates are located in different planes to form a three-dimensional structure, By means of the multilevel light emitting LED substrate and package, and the bulb, a planar LED substrate and package can be processed to be a three-dimensional structure; the process is convenient, the structure is simple, and it is easy to set and control LED chips; moreover, the process efficiency is high, so that the LED package is not easily damaged in the process, and the production efficiency and yield are improved.

Patent Claims
10 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A multilevel light emitting LED substrate comprising a plurality of annular substrates spaced apart from each other, characterized in that, every two adjacent annular substrates among the plurality of annular substrates are connected with each other by using at least one connection part, the plurality of annular substrates are located in different planes to form a three-dimensional structure by stretching and reshaping the connection part, each of the plurality of annular substrates is provided with a disconnected opening, a connecting element is disposed on the opening, the connecting element comprises an outer material wrapping and connecting two ends of the opening, an inner material located in the outer material and without contacting with two ends of the opening, the outer material is made of non-conductive material and the inner material is made of conductive material, the inner material is electrically connected with the LED chips on the annular substrate by a connecting wire.

2

2. The multilevel light emitting LED substrate according to claim 1 , characterized in that there is one connection part between every two adjacent annular substrates, and the connection parts are connected with each other and the positions thereof correspond to each other.

3

3. The multilevel light emitting LED substrate according to claim 1 , characterized in that the plurality of annular substrates is provided with a connecting element, such that the annular substrate forms a broken circuit structure.

4

4. The multilevel light emitting LED substrate according to claim 1 , characterized in that a connecting member is connected between the inner materials of the connecting elements of each annular substrates.

5

5. The multilevel light emitting LED substrate according to claim 4 , characterized in that the connecting member and/or the connection part are/is a bending structure.

6

6. The multilevel light emitting LED substrate according to claim 1 , characterized in that the annular substrate is a polygonal annular structure, a circular ring structure, or an annular structure composed of several arcs and several straight lines.

7

7. The multilevel light emitting LED substrate according to claim 1 , characterized in that the connection part connects one end of the openings of two adjacent annular substrates respectively, and the two ends of the opening of each annular substrate are respectively connected with the ends of the openings of two annular substrates adjacent to said annular substrate by means of different connection parts.

8

8. The multilevel light emitting LED substrate according to claim 1 , characterized in that the plurality of annular substrates are nested with each other, and the plurality of annular substrates are concentrically or eccentrically arranged; or the plurality of annular substrates are arranged next to and separately from each other.

9

9. A multilayered light emitting LED package, comprising a multilevel light emitting LED substrate, characterized in that a plurality of LED chips are arranged in series and/or in parallel on the annular substrate, the multilevel light emitting LED substrate comprises a plurality of annular substrates spaced apart from each other, every two adjacent annular substrates among the plurality of annular substrates are connected with each other by using at least one connection part, the plurality of annular substrates are located in different planes to form a three-dimensional structure by stretching and reshaping the connection part, each of the plurality of annular substrates is provided with a disconnected opening, a connecting element is disposed on the opening, the connecting element comprises an outer material wrapping and connecting two ends of the opening, an inner material located in the outer material and without contacting with two ends of the opening, the outer material is made of non-conductive material and the inner material is made of conductive material, and the inner material is electrically connected with the LED chips on the annular substrate by a connecting wire.

10

10. A multilayered light emitting LED bulb having a multilayered light emitting LED package, characterized in that, the multilayered light emitting LED package comprises a multilevel light emitting LED substrate, the multilevel light emitting LED substrate comprises a plurality of annular substrates spaced apart from each other, every two adjacent annular substrates among the plurality of annular substrates are connected with each other by using at least one connection part, the plurality of annular substrates are located in different planes to form a three-dimensional structure by stretching and reshaping the connection part, the multilayered light emitting LED bulb comprises an outer transparent shell and a stem disposed in the transparent shell, the stem is provided with a lead wire on which at least one LED package is fixed, an electrical connector is disposed at the bottom of the transparent shell and the bottom of the stem, a driver is disposed in the electrical connector, and the lead wire is connected to the driver, each of the plurality of annular substrates is provided with a disconnected opening, a connecting element is disposed on the opening, the connecting element comprises an outer material wrapping and connecting two ends of the opening, an inner material located in the outer material and without contacting with two ends of the opening, the outer material is made of non-conductive material and the inner material is made of conductive material, the inner material is electrically connected with the LED chips on the annular substrate by a connecting wire.

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Patent Metadata

Filing Date

September 7, 2016

Publication Date

April 23, 2019

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Cite as: Patentable. “Multilevel light emitting LED substrate, package and bulb” (US-10269719). https://patentable.app/patents/US-10269719

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