Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof

1. An electronic component module comprising: an electronic component; a mold resin that seals the electronic component; a conductive film that covers the mold resin; and a protective film that covers the conductive film, wherein the protective film includes a protective layer and a low reflective layer that comprises a rough outer surface defining convex portions and concave portions that are configured such that bottoms of the concave portions of the low reflective layer reach the protective layer to expose parts of the protective layer; wherein the low reflective layer is free from contact with the conductive film.

2. The electronic component module as claimed in claim 1 , wherein the low reflective layer has a light reflectance of less than 20%.

3. The electronic component module as claimed in claim 1 , further comprising a substrate having front and back surfaces, wherein the electronic component is mounted on the front surface of the substrate, and wherein the conductive film and the protective film are partially covering the back surface of the substrate.

4. The electronic component module as claimed in claim 1 , wherein the end faces of the conductive film are completely covered with the protective film.

5. The electronic component module as claimed in claim 1 , wherein the protective layer and the low reflective layer comprises Ni.

6. The electronic component module as claimed in claim 1 , wherein the rough outer surface of the low reflective layer is formed by one of an electroless plating and an etching method.

7. The electronic component module as claimed in claim 1 , wherein the rough outer surface of the low reflective layer is configured to reduce halation.