Flame retardant structure for electronic component

A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.