Automated electronic component footprint setup system and a method thereof

1. An automated electronic component footprint setup system, comprising: a component characteristic parameter user interface; a component characteristic parameter management module connected to the component characteristic parameter user interface and an external database for configuring characteristic parameters of an electronic component for the database by an external first user operating the component characteristic parameter user interface, wherein the characteristic parameters of the electronic component include package type, manufacturer information, part number and size information; a component characteristic parameter module connected to the database for accessing the characteristic parameters of the electronic component; a footprint setup user interface provided for configuring setup parameters of an electronic component footprint to be created by an external second user, wherein the setup parameters include component sizes and pad sizes; a setup regulation module connected to the database for accessing component setup regulations of the electronic component footprint in the database; a characteristic operation module connected to the component characteristic parameter management module, the footprint setup user interface and the setup regulation module for configuring characteristic parameters of the electronic component footprint to be created according to the characteristic parameters of the electronic component, the component setup regulations and the setup parameters; a data transformation module connected to the characteristic operation module for transforming the characteristic parameters of the electronic component footprint for conforming to data formats of a specific electronic layout system and offering transformed data; and a component footprint setup module connected to the data transformation module for creating the electronic component footprint according to the transformed data.

2. The automated electronic component footprint setup system as claimed in claim 1 , wherein the electronic component footprint is a footprint of the electronic component mounted on a PCB.

3. The automated electronic component footprint setup system as claimed in claim 1 , wherein the electronic component footprint follows at least one of layout rules and file formats of a circuit layout system.

4. A method for setting up an automated electronic component footprint, comprising: configuring characteristic parameters of an electronic component for an external database by an external first user, wherein the characteristic parameters of the electronic component include package type, manufacturer information, part number and size information; configuring setup parameters of an electronic component footprint to be created by an external second user, wherein the setup parameters include component sizes and pad sizes; accessing component setup regulations of the electronic component footprint in the database; configuring characteristic parameters of the electronic component footprint according to the characteristic parameters of the electronic component, the component setup regulations and the setup parameters; transforming the characteristic parameters of the electronic component footprint for conforming to data formats of a specific electronic layout system and offering transformed data to a component footprint setup module by a data transformation module; and creating the electronic component footprint according to the transformed data.

5. The method for setting up an electronic component footprint as claimed in claim 4 , wherein the electronic component footprint is a footprint of an electronic component mounted on a PCB.

6. The method for setting up an electronic component footprint as claimed in claim 4 , wherein the electronic component footprint follows at least one of layout rules and file formats of a circuit layout system.