Patentable/Patents/US-10340350
US-10340350

Semiconductor structure and manufacturing method thereof

PublishedJuly 2, 2019
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an isolation layer, a gate dielectric layer, a tantalum nitride layer, a tantalum oxynitride layer, an n type work function metal layer and a filling metal. The isolation layer is formed on a substrate, and the isolation layer has a first gate trench. The gate dielectric layer is formed in the first gate trench, the tantalum nitride layer is formed on the gate dielectric layer, and the tantalum oxynitride layer is formed on the tantalum nitride layer. The n type work function metal layer is formed on the tantalum oxynitride layer in the first gate trench, and the filling metal is formed on the n type work function metal layer in the first gate trench.

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Patent Metadata

Filing Date

July 25, 2018

Publication Date

July 2, 2019

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