Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
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September 12, 2017
August 13, 2019
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