Patentable/Patents/US-10414019
US-10414019

Polishing composition

PublishedSeptember 17, 2019
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

An object of the present invention is to provide a polishing composition enabling polishing of an object to be polished at higher speed.Provided is a polishing composition used for polishing an object to be polished in which the polishing composition contains surface-modified abrasive grains, in which an ionic dispersant is directly modified on the surface of the abrasive grains, and dispersing medium, and aggregation of the abrasive grains is suppressed in the dispersing medium.

Patent Claims
11 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A polishing composition used for polishing an object to be polished, the polishing composition comprising: surface-modified abrasive grains in which an ionic dispersant is directly modified on a surface of the abrasive grains; and a dispersing medium, wherein, in the dispersing medium, aggregation of the abrasive grains is suppressed.

2

2. The polishing composition according to claim 1 , wherein the ionic dispersant is polyvinyl alcohol or a derivative thereof.

3

3. The polishing composition according to claim 2 , wherein the polyvinyl alcohol or a derivative thereof is a cation modified polyvinyl alcohol or a derivative thereof.

4

4. The polishing composition according to claim 1 , wherein the object to be polished is an object to be polished which has a silicon-oxygen bond, an object to be polished which has a silicon-silicon bond, or an object to be polished which has a silicon-nitrogen bond.

5

5. The polishing composition according to claim 4 , wherein the object to be polished is an object to be polished which has a silicon-oxygen bond.

6

6. The polishing composition according to claim 1 , further comprising a pH adjusting agent.

7

7. The polishing composition according to claim 1 , wherein the polishing composition has pH of from 2 to 5.

8

8. A method for producing a polishing composition used for polishing an object to be polished, the method comprising mixing surface-modified abrasive grains in which an ionic dispersant is directly modified on a surface of the abrasive grains with a dispersing medium.

9

9. The method for producing the polishing composition according to claim 8 , wherein the surface-modified abrasive grains are produced by comprising: a first step of preparing an abrasive grain dispersion liquid containing the abrasive grains, a second step of adjusting the abrasive grain dispersion liquid to have pH of from 7 to 9 to produce a pH adjusted dispersion liquid, and a third step of mixing the pH adjusted dispersion liquid with the ionic dispersant.

10

10. The method for producing the polishing composition according to claim 9 , wherein the third step is carried out by stirring at 10 to 60° C.

11

11. A method for polishing an object to be polished by using the polishing composition according to claim 1 .

Classification Codes (CPC)

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Patent Metadata

Filing Date

September 21, 2016

Publication Date

September 17, 2019

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Cite as: Patentable. “Polishing composition” (US-10414019). https://patentable.app/patents/US-10414019

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