A method of manufacturing a display device, includes providing a substrate including a first stepped part, forming a metal layer on the substrate and the first stepped part, forming an organic layer pattern on the metal layer at a position corresponding to a sidewall of the stepped part, forming a photosensitive layer on the metal layer and the organic layer pattern, patterning the photosensitive layer to form a photosensitive layer pattern adjacent to the organic layer pattern, and forming a metal line by removing the organic layer pattern and an exposed portion of the metal layer through an etching process using the photosensitive layer pattern as a mask.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a display device, comprising: providing a substrate including a first stepped part; forming a metal layer on the substrate and the first stepped part; forming an organic layer pattern on the metal layer at a position corresponding to a sidewall of the first stepped part; forming a photosensitive layer on the metal layer and the organic layer pattern; patterning the photosensitive layer to form a photosensitive layer pattern adjacent to the organic layer pattern; and forming a metal line by removing the organic layer pattern and an exposed portion of the metal layer through an etching process using the photosensitive layer pattern as a mask.
2. The method of claim 1 , wherein the first stepped part has a height of 2000 Å or more.
3. The method of claim 1 , further comprising: forming an insulating layer on the substrate and the first stepped part; and forming the metal layer on the insulating layer.
4. The method of claim 1 , wherein the organic layer pattern includes a colored dye or pigment.
5. The method of claim 1 , wherein the organic layer pattern has a reflectivity ranging from 1% to 30%.
6. The method of claim 1 , wherein the metal line is formed to have a width of 2 μm or less.
7. A method of manufacturing a display device, comprising: providing a substrate; forming a plurality of patterns on the substrate; a plurality of steps is formed on a surface of the substrate, wherein each of the plurality of patterns is spaced apart from each other by a predetermined distance; forming a metal layer on the substrate and the plurality of patterns; forming a plurality of organic layer patterns on the metal layer at positions corresponding to sidewalls of the plurality of patterns; forming a photosensitive layer on the metal layer and the plurality of organic layer patterns; patterning the photosensitive layer to form a photosensitive layer pattern between the plurality of organic layer patterns; and forming a plurality of metal lines by removing the organic layer patterns and exposed portions of the metal layer through an etching process using the photosensitive layer pattern as a mask.
8. The method of claim 7 , wherein each of the plurality of patterns has a height of 2000 Å or more, and the predetermined distance between the plurality of patterns is 5 μm or less.
9. The method of claim 7 , further comprising: forming an insulating layer on the substrate and the plurality of patterns; and forming the metal layer on the insulating layer.
10. The method of claim 7 , wherein the organic layer pattern includes a colored dye or pigment.
11. The method of claim 7 , wherein the organic layer pattern has a reflectivity ranging from 1% to 30%.
12. The method of claim 7 , wherein the metal line is formed to have a width of 2 μm or less.
13. A method of manufacturing a display device, comprising: providing a substrate including a plurality of stepped parts, wherein each of the plurality of stepped parts includes sidewalls that are slanted; forming a first insulating layer on the substrate and the plurality of stepped parts; forming a metal layer on the first insulating layer; forming an organic layer pattern on the metal layer, wherein the organic layer pattern overlaps the sidewalls of the plurality of stepped parts that are slanted; forming a photosensitive layer on the metal layer; patterning the photosensitive layer to form a photosensitive layer pattern and to expose a portion of the metal layer; and forming a metal line by removing the organic layer pattern and the exposed portion of the metal layer.
14. The method of claim 13 , wherein the plurality of stepped parts includes a first stepped part and a second stepped part adjacent to the first stepped part, and the photosensitive layer pattern is formed between the first and second stepped parts.
15. The method of claim 14 , wherein the photosensitive layer pattern is formed between sidewalls of the first and second stepped parts that are overlapped by the organic layer pattern.
16. The method of claim 13 , wherein the organic layer pattern and the exposed portion of the metal layer are removed through an etching process by using the photosensitive layer pattern as a mask.
17. The method of claim 13 , wherein the plurality of stepped parts includes a first stepped part and a second stepped part adjacent to the first stepped part, and the first stepped part and the second stepped are spaced apart from each other by a predetermined distance.
18. The method of claim 17 , wherein the predetermined distance between the first stepped part and the second stepped part is 5 μm or less.
19. The method of claim 13 , wherein the metal line is formed to have a width of 2 μm or less.
20. The method of claim 13 , wherein the organic layer pattern has a reflectivity of 30% or less.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 3, 2018
February 4, 2020
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