Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing a thermal ground plane, the method comprising: providing a first planar substrate member; disposing a liquid channel on the first planar substrate member; applying a coating to a mesh structure, wherein the coating creates corrosion protection for the mesh structure; disposing the mesh structure on either or both the first planar substrate member and the liquid channel; disposing a plurality of support on structures on the mesh structure; disposing a second planar substrate member on the first planar substrate member such that the second planar substrate member and the first planar substrate member enclose the liquid channel, the mesh structure, and a vapor core; forming the vapor core between the second planar substrate member and the first planar substrate member, the liquid channel, and the mesh structure, such that the mesh structure separates the liquid channel from the vapor core; sealing the thermal ground plane by sealing at least a portion of the first planar substrate member with a portion of the second planar substrate member; and charging the thermal ground plane with a working fluid, wherein the working fluid is fully enclosed within the thermal ground plane.
2. The method according to claim 1 , wherein at least one of the mesh structure, the first planar substrate member, and the second planar substrate member are flexible.
3. The method according to claim 1 , wherein the liquid channel is disposed on the first planar substrate as etched micro-channels on planar substrate or etched micro-cubes on the first planar substrate member.
4. The method according to claim 1 , wherein the liquid channel is bonded to the first planar substrate member.
5. The method according to claim 1 , wherein the liquid channel electroplated to the first planar substrate member.
6. The method according to claim 1 , wherein the liquid channel is patterned on the planar substrate with photolithography.
7. The method according to claim 1 , wherein the mesh structure is directly boned with either or both the first planar substrate and the liquid channel.
8. The method according to claim 1 , wherein the mesh structure comprises ether a micro-wicking structure or nano-wicking structure.
9. The method according to claim 1 , wherein the plurality of support members comprise a polymer.
10. The method according to claim 1 , wherein the plurality of support members comprise a plurality of spheres disposed between the mesh structure and the second planar substrate.
11. The method according to claim 1 , further comprising applying a coating to at least one of the mesh structure, the first planar substrate member, and the second planar substrate member, wherein the coating creates at least one hydrophobic region.
12. The method according to claim 1 , further comprising applying a coating to at least one of the first planar substrate member, and the second planar substrate member, wherein the coating creates at least one hydrophilic region.
13. A thermal ground plane comprising: a first planar substrate member; a liquid channel disposed on the first planar substrate member; a mesh structure disposed on either or both the first planar substrate member and the liquid channel; a second planar substrate member disposed on the first planar substrate member such that the second planar substrate member and the first planar substrate member enclose the liquid channel, the mesh structure, and a vapor core; the vapor core between the second planar substrate member and the first planar substrate member, the liquid channel, and the mesh structure, wherein the mesh structure separates the liquid channel from the vapor core; and a plurality of support structures disposed on the mesh structure, wherein at least a portion of the first planar substrate member is sealed with a portion of the second planar substrate member, wherein the thermal ground plane fully encloses a working fluid within the thermal ground plane, and wherein the mesh structure has a coating that creates corrosion protection or the mesh structure.
14. The thermal ground plane according to claim 13 , wherein the liquid channel comprises a plurality of etched micro-channels on the planar substrate or a plurality of etched micro-cubes on the planar substrate.
15. The thermal ground plane according to claim 13 , wherein the liquid channel is bonded to the planar substrate.
16. The thermal ground plane according to claim 13 , wherein the mesh structure is bonded with either or both the first planar substrate member and the liquid channel.
17. The thermal ground plane according to claim 13 , wherein the mesh structure comprises either a micro-wicking structure or a nano-wicking structure.
18. The thermal ground plane according to claim 13 , wherein the plurality of support structures are bonded with the second planar substrate member.
19. The thermal ground plane according to claim 13 , further comprising a plurality of thermal vias or one or more wicking structures disposed between the liquid channel and either or both a condenser region and an evaporator region.
20. The thermal ground plane according to claim 13 , wherein the plurality of support structures comprise a plurality of spheres.
21. The thermal ground plane according to claim 13 , wherein the plurality of support structures are bond to either or both the mesh structure or the second planar substrate member.
22. A thermal ground plane comprising: a first planar substrate member; a liquid channel disposed on the first planar substrate member; a mesh structure disposed on either or both the first planar substrate member and the liquid channel; a second planar substrate member disposed on the first planar substrate member; at least one structure disposed between the second planar substrate member and the mesh structure; a vapor core defined at least by the structure, the second planar substrate member, and the mesh structure, wherein the mesh structure separates the liquid channel from the vapor core; and wherein at least a portion of the first planar substrate member is sealed with a portion of the second planar substrate member, wherein the thermal ground plane fully encloses a working fluid within the thermal ground plane, and wherein the mesh structure has a coating that creates corrosion protection for the mesh structure.
23. The thermal ground plane according to claim 22 , further comprising a plurality of support structures disposed on the mesh structure.
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February 17, 2017
February 25, 2020
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