Ultra-thin thermally enhanced electro-magnetic interference shield package

1. A method of fabricating an electronic package, comprising the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material by a first molding process; reducing a thickness of the semiconductor chips by a process of trimming or grinding from a top encapsulation layer of the semiconductor chips to form thin semiconductor chips; and forming an electro-magnetic interference shield layer over the thin semiconductor chips by a second molding process.

2. The method according to claim 1 , wherein the substrate is a single layer or multilayer substrate with at least one ground trace.

3. The method according to claim 1 , wherein the substrate includes at least one ground terminal and is electrically connected to a ground trace.

4. The method according to claim 3 , wherein the encapsulation layer is cut through exposing the ground trace on the substrate.

5. The method according to claim 4 , wherein a carrier is disposed on one side of the substrate.

6. The method according to claim 5 , wherein the electro-magnetic interference shield layer extends over a side surface of the substrate.

7. The method according to claim 6 , wherein the electro-magnetic interference shield layer covers a bottom surface of the semiconductor chip.

8. The method according to claim 1 , wherein edges of the encapsulation layer and the electro-magnetic interference shield layer are bevelled by a process of cutting.

9. The method according to claim 8 , wherein the connect pad is a chip connect pad and a substrate to chip connect pad.

10. The method according to claim 1 , wherein at least part of the electro-magnetic interference shield layer is in contact with the thin semiconductor chips without a gap formed therebetween.