The disclosed technology generally relates to patterning structures in semiconductor fabrication, and more particularly to patterning structures using mask structures having bridged lines. In one aspect, a method for patterning a target layer comprises: forming on the target layer a plurality of parallel material lines spaced apart such that longitudinal gaps exposing the target layer are formed between the material lines, filling the gaps with a sacrificial material, forming a hole by removing the sacrificial material along a portion of one of the gaps, the hole extending across the gap and exposing a surface portion of the target layer and sidewall surface portions of material lines on opposite sides of the one gap, performing a selective deposition process adapted to grow a fill material selectively on the one or more surface portions inside the hole, thereby forming a block mask extending across the gap, removing, selectively to the material lines and the block mask, the sacrificial material from the target layer to expose the gaps, the one gap being interrupted in the longitudinal direction by the block mask, and transferring a pattern including the material lines and the block mask into the target layer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of patterning a target layer, the method comprising: forming on the target layer a plurality of parallel lines extending in a first direction, wherein adjacent ones of the lines are spaced apart in a second direction by a gap that exposes the target layer; filling the gap with a sacrificial material; forming a hole vertically through the sacrificial material in the gap and extending laterally across the gap in the second direction, thereby exposing one or more surface portions including a surface portion of the target layer and surface portions of opposing sidewalls of the adjacent ones of the lines; selectively depositing a fill material on the one or more surface portions inside the hole, thereby forming a block mask extending across the gap; removing, selectively against the lines and the block mask, the sacrificial material to expose surface of the gap, the gap being interrupted in the first direction by the block mask; and transferring a pattern including the lines and the block mask to the target layer.
2. The method according to claim 1 , further comprising, prior to selectively depositing the fill material, treating to functionalize one or more surface portions inside the hole and/or to passivate exposed surface portions of the sacrificial material.
3. The method according to claim 2 , wherein treating includes etching.
4. The method according to claim 3 , wherein the sacrificial material comprises an oxide and one or both of the lines and the target layer comprise a non-oxide material, and wherein treating includes etching the oxide.
5. The method according to claim 3 , wherein treating includes wet etching with a hydrofluoric acid (HF)-based etchant.
6. The method according to claim 2 , wherein treating is adapted to increase a hydrophilicity of the one or more of surface portions inside the hole and/or to increase the hydrophobicity of exposed surface portions of the sacrificial material.
7. The method according to claim 2 , wherein the sacrificial material is an organic material, and wherein treating includes treating with an etchant comprising molecular hydrogen (H 2 ).
8. The method according to claim 1 , wherein the fill material is a metal or a dielectric.
9. The method according to claim 1 , wherein selectively depositing includes depositing the fill material using an atomic layer deposition process.
10. The method according to claim 1 , wherein the fill material is a metal and selectively depositing includes depositing the fill material using an electro-less deposition process.
11. The method according to claim 1 , wherein the fill material is a metal, and wherein selectively depositing includes depositing a metal seed layer on the one or more surface portions inside the hole using an atomic layer deposition process and subsequently filling the hole with the fill material using an electro-less deposition process.
12. The method according to claim 1 , wherein filling the gap with the sacrificial material includes filling the gap and covering the lines.
13. The method according to claim 12 , wherein the sacrificial material includes an upper thickness portion arranged above the lines and a lower thickness portion arranged within the gap, wherein the hole includes an upper hole portion extending through the upper thickness portion and a lower hole portion extending through the lower thickness portion.
14. The method according to claim 1 , further comprising forming at least a second hole vertically through the sacrificial material in a second gap and extending laterally across the second gap in the second direction and exposing one or more second surface portions including a second surface portion of the target layer and second surface portions of opposing sidewalls of second adjacent ones of the lines, wherein selectively depositing the fill material includes selectively growing on the one or more second surface portions inside the second hole, thereby forming a second block mask extending across the second gap.
15. The method according to claim 1 , further comprising, subsequent to removing the sacrificial material and prior to transferring the pattern to the target layer: forming a conformal layer covering the target layer, the lines and the block mask, and etching the conformal layer anisotropically such that the target layer is exposed in the gaps and portions of the conformal layer remain on sidewalls of the lines and the block mask.
16. A method of patterning, comprising: providing a substrate having formed thereon a blanket target layer to be patterned; forming a plurality of lines formed of a first material extending in a first direction, wherein adjacent ones of the lines are laterally separated in a second direction by a gap; filling the gap with a second material; forming an etch mask on the second material, the etch mask having an opening having a width wider than a width of the gap, wherein the opening laterally encompasses the gap in the second direction; using the etch mask to form a hole through the second material in the gap such that a width of the hole in the second direction is limited by the width of the gap; filling the hole with a third material to form a bridging structure contacting the adjacent ones of the lines; and removing the second material selectively against the third material and the first material such that a pattern comprising the lines bridged by the bridging structure is formed.
17. The method of claim 16 , wherein filling the hole comprises selectively depositing the third material on one or more exposed surfaces of the target layer, the lines and the second material.
18. The method of claim 16 , further comprising using the pattern as an etch mask to pattern the blanket target layer.
19. The method of of claim 16 , wherein the width of the opening of the etch mask is smaller than a combined width of the adjacent ones of the lines and the gap formed therebetween.
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May 9, 2018
June 2, 2020
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