Semiconductor device with shielding structure for cross-talk reduction

1. A semiconductor device comprising: a die embedded in a molding material; a first dielectric layer over the die and the molding material; a conductive line along an upper surface of the first dielectric layer distal to the die; a second dielectric layer over the first dielectric layer and the conductive line; and a first conductive structure and a second conductive feature on opposing sides of the conductive line and spaced apart from the conductive line, wherein the first conductive feature and the second conductive feature extend through at least the first dielectric layer or the second dielectric layer, wherein a first longitudinal axis of the first conductive feature and a second longitudinal axis of the second conductive feature are parallel to a third longitudinal axis of the conductive line.

2. The semiconductor device of claim 1 , wherein the conductive line has a first height measured along a first direction perpendicular to an upper surface of the molding material, wherein the first conductive structure and the second conductive structure have a second height measured along the first direction, where a ratio between the second height and the first height is larger than 1.

3. The semiconductor device of claim 1 , wherein a width of the conductive line is D 2 , and a distance between the conductive line and the first conductive structure is D 1 , wherein a ratio between D 1 and D 2 is between about 0.1 and about 5.

4. The semiconductor device of claim 1 , wherein the first conductive structure comprises a first ground trench that extends through the first dielectric layer, and the second conductive structure comprises a second ground trench that extends through the first dielectric layer.

5. The semiconductor device of claim 4 , wherein the first conductive structure further comprises a first plurality of ground vias in the second dielectric layer and connected to the first ground trench, and the second conductive structure further comprises a second plurality of ground vias in the second dielectric layer and connected to the second ground trench.

6. The semiconductor device of claim 5 , further comprising a ground plane over the second dielectric layer and connected to the first plurality of ground vias and to the second plurality of ground vias, wherein the ground plane extends continuously from the first plurality of ground vias to the second plurality of ground vias.

7. The semiconductor device of claim 5 , wherein the first plurality of ground vias are disposed along a first line parallel to the third longitudinal axis of the conductive line, and the second plurality of ground vias are disposed along a second line parallel to the first line.

8. The semiconductor device of claim 7 , wherein in a top view, a first distance between the first line and the third longitudinal axis is smaller than a second distance between the second line and the third longitudinal axis.

9. The semiconductor device of claim 1 , wherein the first conductive structure and the second conductive structure extend through the first dielectric layer and the second dielectric layer.

10. The semiconductor device of claim 9 , wherein each of the first conductive structure and the second conductive structure comprises a lower ground trench in the first dielectric layer and an upper ground trench in the second dielectric layer, the lower ground trench connected to the upper ground trench.

11. The semiconductor device of claim 10 , wherein a first distance between the lower ground trench of the first conductive structure and the lower ground trench of the second conductive structure is different from a second distance between the upper ground trench of the first conductive structure and the upper ground trench of the second conductive structure.

12. The semiconductor device of claim 10 , further comprising a ground plane over the second dielectric layer and connected to the upper ground trench of the first conductive structure and the upper ground trench of the second conductive structure, wherein the ground plane extends continuously from the upper ground trench of the first conductive structure to the upper ground trench of the second conductive structure.

13. A semiconductor device comprising: a die surrounded by a molding material; a first dielectric layer over the molding material; a conductive line along a first surface of the first dielectric layer facing away from the die; a second dielectric layer over the conductive line and the first dielectric layer; and an electromagnetic (EM) shielding structure at least partially in the first dielectric layer or the second dielectric layer, the EM shielding structure comprising: a first conductive feature on a first side of the conductive line; and a second conductive feature on a second opposing side of the conductive line, wherein longitudinal axes of the first conductive feature and the second conductive feature are parallel to a first longitudinal axis of the first conductive line.

14. The semiconductor device of claim 13 , wherein a first bottom surface of the first conductive feature and a second bottom surface of the second conductive feature are in physical contact with the molding material, wherein the first bottom surface and the second bottom surface face the molding material.

15. The semiconductor device of claim 13 , wherein the first conductive feature comprises a first ground trench in the first dielectric layer, and the second conductive feature comprises a second ground trench in the first dielectric layer.

16. The semiconductor device of claim 15 , further comprising a ground plane over the second dielectric layer, the ground plane extending over the first ground trench, the conductive line, and the second ground trench, the ground plane electrically coupled to the first ground trench and the second ground trench.

17. A method comprising: embedding a die in a molding material; forming a first dielectric layer over the molding material and the die; forming a conductive line over an upper surface of the first dielectric layer facing away from the die; forming a first trench opening extending through the first dielectric layer, wherein a longitudinal axis of the first trench opening is parallel with the upper surface of first dielectric layer, and the molding material is exposed at a bottom of the first trench opening; and filling the first trench opening with an electrically conductive material to form a first ground trench.

18. The method of claim 17 , wherein the first ground trench is formed to have a first height larger than a second height of the conductive line, wherein the first height and the second height are measured along a direction perpendicular to the upper surface of the first dielectric layer.

19. The method of claim 17 , further comprising: forming a second dielectric layer over the first dielectric layer; and forming a plurality of ground vias in the second dielectric layer, wherein the plurality of ground vias is disposed along on a line parallel to a longitudinal axis of the conductive line, wherein the plurality of ground vias is electrically and mechanically coupled to the first ground trench.

20. The method of claim 17 , further comprising: forming a second dielectric layer over the first dielectric layer; forming a second trench opening extending through the second dielectric layer, wherein a longitudinal axis of the second trench opening is parallel with a longitudinal axis of the conductive line, the second trench opening exposing the first ground trench; and filling the second trench opening with the electrically conductive material to form a second ground trench.