A field-effect transistor including: a gate electrode, which is configured to apply gate voltage; a source electrode and a drain electrode, which are configured to take electric current out; a semiconductor layer, which is disposed to be adjacent to the source electrode and the drain electrode; and a gate insulating layer, which is disposed between the gate electrode and the semiconductor layer, wherein the gate insulating layer includes a first gate insulating layer containing a first oxide containing Si and an alkaline earth metal and a second gate insulating layer disposed to be in contact with the first gate insulating layer and containing a paraelectric amorphous oxide containing a Group A element which is an alkaline earth metal and a Group B element which is at least one selected from the group consisting of Ga, Sc, Y, and lanthanoid.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A field-effect transistor comprising: a gate electrode; a source electrode and a drain electrode; a semiconductor layer, which is disposed to be adjacent to the source electrode and the drain electrode; and a gate insulating layer, wherein the gate insulating layer includes a first gate insulating layer containing a first oxide containing Si, and a second gate insulating layer containing an oxide containing a Group A element which is an alkaline earth metal and a Group B element which is at least one selected from the group consisting of Ga, Sc, Y, and lanthanoid, and wherein the first gate insulating layer is in contact with the gate electrode, and the second gate insulating layer is in contact with the semiconductor layer and the first gate insulating layer.
2. The field-effect transistor according to claim 1 , wherein the first oxide contains at least one of Al and B.
3. The field-effect transistor according to claim 1 , wherein the oxide in the second gate insulating layer is a paraelectric amorphous oxide contains at least one of Al, Ti, Zr, Hf, Nb, and Ta.
4. The field-effect transistor according to claim 1 , wherein the field-effect transistor is a top gate field-effect transistor.
5. The field-effect transistor according to claim 1 , wherein the field-effect transistor is a bottom gate field-effect transistor.
6. The field-effect transistor according to claim 1 , wherein the semiconductor layer contains an oxide semiconductor.
7. The field-effect transistor according to claim 1 , wherein the second gate insulating layer is in contact with the source electrode and the drain electrode.
8. The field-effect transistor according to claim 1 , where the first gate insulating layer is in contact with the source electrode and the drain electrode.
9. A display element comprising: a light control element configured to control light output according to a driving signal; and a driving circuit containing the field-effect transistor according to claim 1 and configured to drive the control element.
10. The display element according to claim 9 , wherein the light control element contains an electroluminescent element, and electrochromic element, a liquid crystal element, an electrophoretic element, or an electrowetting element.
11. An image display device configured to display an image corresponding to image data, the image display device comprising: a plurality of display elements arranged in a form of matrix, each of the plurality of display elements being the same as the display element according to claim 9 ; a plurality of wired lines configured to individually apply gate voltage to the field-effect transistors in the plurality of display elements; and a display control circuit configured to individually control the gate voltage of the field-effect transistors via the plurality of wired lines correspondingly to the image data.
12. A system comprising: the image display device according to claim 11 ; and circuitry configured to generate image data based on image information to be displayed and to output of the image data to the image display device.
13. A field-effect transistor comprising: a gate electrode; a source electrode and a drain electrode; a semiconductor layer, which is disposed to be adjacent to the source electrode and the drain electrode; and a gate insulating layer, wherein the gate insulating layer includes a first gate insulating layer containing a first oxide containing Si, and a second gate insulating layer containing an oxide containing a Group A element which is an alkaline earth metal and a Group B element which is at least one selected from the group consisting of Ga, Sc, Y, and lanthanoid, and wherein the second gate insulating layer is in contact with the gate electrode, and the first gate insulating layer is in contact with the semiconductor layer and the second gate insulating layer.
14. The field-effect transistor according to claim 13 , wherein the first oxide contains at least one of Al and B.
15. The field-effect transistor according to claim 13 , wherein the oxide in the second gate insulating layer is an oxide containing at least one of Al, Ti, Zr, Hf, Nb, and Ta.
16. The field-effect transistor according to claim 13 , wherein the field-effect transistor is a top gate field-effect transistor.
17. The field-effect transistor according to claim 13 , wherein the field-effect transistor is a bottom gate field-effect transistor.
18. The field-effect transistor according to claim 13 , wherein the semiconductor layer contains an oxide semiconductor.
19. The field-effect transistor according to claim 13 , wherein the second gate insulating layer is in contact with the source electrode and the drain electrode.
20. The field-effect transistor according to claim 13 , wherein the first gate insulating layer is in contact with the source electrode and the drain electrode.
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January 25, 2019
June 30, 2020
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