Lead frame

1. A lead frame comprising: a plurality of leads formed from a metal plate having a front side and a back side; a first resin member formed to fill spaces between the plurality of leads; and a second resin member, wherein the plurality of leads are provided with a plating layer formed on a front-side surface of the metal plate at top portions of the plurality of leads, a front-side surface of the plating layer forming faces that are to serve as internal connecting portions of the plurality of leads, wherein the first resin member is formed of a fixing resin and a reinforcing resin integrally joined together, with a front-side surface of the fixing resin being coplanar with the front-side surface of the plating layer so that the plurality of leads have side faces thereof from the front side to the back side fully fixed with the first resin member, wherein the second resin member is formed of a permanent resist or a polyimide tape, applied to a planar surface formed of the front-side surface of the fixing resin of the first resin member and the front-side surface of the plating layer, so as to be at a level higher than the faces that are to serve as the internal connecting portions of the plurality of leads, and the second resin member has openings for leaving the faces that are to serve as the internal connecting portions of the plurality of leads uncovered, wherein the openings in the second resin member are arranged at positions over which a semiconductor element is to be mounted, so as to allow flip chip connection of the semiconductor element with the internal connecting portions of the plurality of leads via connecting solder filled in recesses formed by the internal connecting portions of the plurality of leads and inner circumferential faces of the openings in the second resin member, and wherein each of the recesses formed by the internal connecting portions of the plurality of leads and the inner circumferential faces of the openings in the second resin member has a capacity sufficient to prevent the connecting solder as melted from overflowing, so that the semiconductor element and the internal connecting portions of the plurality of leads are to be connected to each other via the connecting solder while a back surface of the semiconductor element is fitted to the second resin layer.

2. The lead frame according to claim 1 , wherein each of the openings in the second resin member is formed to have a size so as to leave an entirety or a part of each of the faces that are to serve as internal connecting portions of the plurality of leads uncovered.

3. The lead frame according to claim 1 , wherein each of the plurality of leads is formed to have a front-side face which is larger than a back-side face.

4. The lead frame according to claim 1 , wherein the plating layer is a first plating layer and the plurality of leads are provided with a second plating layer formed on a back-side surface of the metal plate at bottom portions of the plurality of leads, a back-side surface of the second plating layer forming faces that are to serve as external connecting portions of the plurality of leads.

5. The lead frame according to claim 1 , wherein the plurality of leads are to be connected to each other via the connecting solder while an entirety of the back surface of the semiconductor element is fitted to the second resin layer.

6. A lead frame comprising: a metal plate partitioned into a plurality of lead portions by a concavity formed on a front-side surface thereof; a plating layer formed on the front-side surface of the metal plate at top portions of the plurality of lead portions; a first resin member formed to fill the concavity between the plurality of lead portions; and a second resin member, wherein a front-side surface of the plating layer forms faces that are to serve as internal connecting portions of the plurality of lead portions and is coplanar with a front-side surface of the first resin member so that the plurality of lead portions have side faces thereof fully fixed with the first resin member, wherein the second resin member is formed of a permanent resist or a polyimide tape, applied to a planar surface formed of the front-side surface of the first resin member and the front-side surface of the plating layer, so as to be at a level higher than the faces that are to serve as the internal connecting portions of the plurality of lead portions, and the second resin member has openings for leaving the faces that are to serve as the internal connecting portions of the plurality of lead portions uncovered, wherein the openings in the second resin member are arranged at positions over which a semiconductor element is to be mounted, so as to allow flip chip connection of the semiconductor element with the internal connecting portions of the plurality of lead portions via connecting solder filled in recesses formed by the internal connecting portions of the plurality of lead portions and inner circumferential faces of the openings in the second resin member, and wherein each of the recesses formed by the internal connecting portions of the plurality of lead portions and the inner circumferential faces of the openings in the second resin member has a capacity sufficient to prevent the connecting solder as melted from overflowing, so that the semiconductor element and the internal connecting portions of the plurality of lead portions are to be connected to each other via the connecting solder while a back surface of the semiconductor element is fitted to the second resin layer.

7. The lead frame according to claim 6 , wherein each of the openings in the second resin member is formed to have a size so as to leave an entirety or a part of each of the faces that are to serve as internal connecting portions of the plurality of lead portions uncovered.

8. The lead frame according to claim 6 , wherein the plurality of lead portions are to be connected to each other via the connecting solder while an entirety of the back surface of the semiconductor element is fitted to the second resin layer.