Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, a method includes forming a plurality of fins, individual ones of the plurality of fins along a first direction. A plurality of gate structures is formed over the plurality of fins, individual ones of the gate structures along a second direction orthogonal to the first direction. A dielectric material structure is formed between adjacent ones of the plurality of gate structures. A portion of one of the plurality of gate structures is removed to expose a portion of each of the plurality of fins. The exposed portion of each of the plurality of fins is removed. An insulating layer is formed in locations of the removed portion of each of the plurality of fins.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An integrated circuit structure, comprising: a fin comprising silicon, the fin having a longest dimension along a first direction; an isolation structure separating a first upper portion of the fin from a second upper portion of the fin along the first direction, the isolation structure having a center along the first direction, the isolation structure having a longest dimension along a second direction orthogonal to the first direction, and the isolation structure having a first end opposite a second end along the second direction; a first gate structure over the first upper portion of the fin, the first gate structure having a longest dimension along the second direction, wherein a center of the first gate structure is spaced apart from the center of the isolation structure by a pitch along the first direction; a second gate structure over the first upper portion of the fin, the second gate structure having a longest dimension along the second direction, wherein a center of the second gate structure is spaced apart from the center of the first gate structure by the pitch along the first direction; a third gate structure over the second upper portion of the fin, the third gate structure having a longest dimension along the second direction, wherein a center of the third gate structure is spaced apart from the center of the isolation structure by the pitch along the first direction; a fourth gate structure along the second direction, the fourth gate structure in direct physical contact with the first end of the isolation structure; and a fifth gate structure along the second direction, the fifth gate structure in direct physical contact with the second end of the isolation structure.
2. The integrated circuit structure of claim 1 , wherein each of the first gate structure, the second gate structure and the third gate structure comprises a gate electrode on and between sidewalls of a high-k gate dielectric layer.
3. The integrated circuit structure of claim 2 , wherein each of the first gate structure, the second gate structure and the third gate structure further comprises an insulating cap on the gate electrode and on the sidewalls of the high-k gate dielectric layer.
4. The integrated circuit structure of claim 1 , further comprising: a first epitaxial semiconductor region on the first upper portion of the fin between the first gate structure and the isolation structure; a second epitaxial semiconductor region on the first upper portion of the fin between the first gate structure and the second gate structure; and a third epitaxial semiconductor region on the second upper portion of the fin between the third gate structure and the isolation structure.
5. The integrated circuit structure of claim 4 , wherein the first, second and third epitaxial semiconductor regions comprise silicon and germanium.
6. The integrated circuit structure of claim 4 , wherein the first, second and third epitaxial semiconductor regions comprise silicon.
7. The integrated circuit structure of claim 1 , wherein the isolation structure induces a stress on the first upper portion of the fin and on the second upper portion of the fin.
8. The integrated circuit structure of claim 7 , wherein the stress is a compressive stress.
9. The integrated circuit structure of claim 7 , wherein the stress is a tensile stress.
10. The integrated circuit structure of claim 1 , wherein the isolation structure has a top substantially co-planar with a top of the first gate structure, with a top of the second gate structure, and with a top of the third gate structure.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 29, 2017
August 25, 2020
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