Positioning device, loading and/or unloading system and method for operating a positioning device

1. A loading and/or unloading system for loading and/or unloading wafers from a wafer transportation container with a positioning device for positioning the wafer transportation container in a loading and/or unloading position of a loading and/or unloading station by contactlessly controlling an at least two-dimensional movement of the wafer transportation container in such a manner that the wafer transportation container assumes a spatial alignment in a plane which lies at least substantially perpendicular to a main direction of movement, along which the wafer transportation container moves during a coupling process, when approaching the loading and/or unloading position, in which the wafer transportation container is connectable to the loading and/or unloading station in a vacuum-tight manner, the positioning device comprising: the loading and/or unloading station, configured at least for loading and/or unloading wafers from the wafer transportation container, the wafer transportation container, a final positioning mechanism, which is realized in a contacting manner comprising a guide rail of a guide unit with at least one guide projection slidably engageable in the guide rail, a clean room-suitable pre-positioning mechanism which is configured for a contactless pre-positioning of the wafer transportation container in a coupling process of the wafer transportation container and the loading and/or unloading station, with the clean room-suitable contactless pre-positioning mechanism being independent of any wafer transportation container transport which is configured for logistics of wafer transportation containers, and a controller, including a processor and a storage with a control and/or regulation program stored therein which is executed by the processor, wherein said controller is configured to control and/or regulate the pre-positioning mechanism to contactlessly pre-position the wafer transportation container in the coupling process of the wafer transportation container and the loading and/or unloading station, the clean room-suitable contactless pre-positioning mechanism being realized separately from the final positioning mechanism, the clean room-suitable pre-positioning mechanism comprising: at least one positioning element, which is realized as a permanent magnet, which is arranged on the wafer transportation container and which is configured for the purpose of generating at least one positioning force field, and at least one further positioning element, which includes at least one magnetic coil, which is configured for the purpose of generating at least one contactlessly transmissible positioning force field and which, for a purpose of interacting with a static magnetic field of the at least one positioning element, is configured for a generating of a controllable and/or regulatable magnetic field by means of the magnetic coil, wherein the clean room-suitable contactless pre-positioning mechanism is arranged in a proximity to the loading and/or unloading station and is configured for a proximity positioning of the wafer transportation container in the loading and/or unloading position, and wherein the clean room-suitable contactless pre-positioning mechanism is configured for the purpose of generating a force which acts in proximity to the loading and/or unloading station and which develops its greatest effect in a proximity to the loading and/or unloading station.

2. The loading and/or unloading system according to claim 1 , wherein the pre-positioning mechanism is configured for the purpose of pre-positioning the wafer transportation container in such a manner that a deviation from an ideal loading and/or unloading position is no more than 3 mm, wherein the ideal loading and/or unloading position is realized as a position of the wafer transportation container in which a contact region of the wafer transportation container and a contact region of an opening element of the loading and/or unloading station overlap in such a manner that a maximum gas tightness of a connection between wafer transportation container and loading and/or unloading station is achieved.

3. The loading and/or unloading system according to claim 1 , wherein the pre-positioning mechanism is configured for the purpose of generating at least one repulsion force for the pre-positioning.

4. The loading and/or unloading system according to claim 1 , wherein the at least one positioning element is realized at least partly integrally with the wafer transportation container.

5. The loading and/or unloading system according to claim 1 , wherein the at least one further positioning element is connected in a captive manner to the loading and/or unloading station.

6. The loading and/or unloading system according to claim 5 , wherein the at least one further positioning element is supported so as to be movable relative to the loading and/or unloading station.

7. A method for an operation of the loading and/or unloading system for loading and/or unloading wafers from the wafer transportation container with the positioning device according to claim 1 , wherein in the coupling process, the wafer transportation container is pre-positioned contactlessly relative to the loading and/or unloading station by contactlessly controlling the at least two-dimensional movement of the wafer transportation container so that the wafer transportation container assumes the spatial alignment when approaching the loading and/or unloading position, wherein the contactless pre-positioning is independent of any wafer transportation container transport which is configured for logistics of wafer transportation containers.

8. The method according to claim 7 , wherein the wafer transportation container is pre-positioned directly following external rough positioning.