Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor chip package comprising: a controller; a semiconductor microphone; and a housing for at least one semiconductor chip, wherein at least a portion of an outer cover portion of the housing is configured as a sound generator to generate and transmit sound waves based on electrical signals provided by an integrated circuit of the at least one semiconductor chip, without the sound waves passing through an aperture in the housing, wherein the sound generator and the controller are intergrated in a single semiconductor chip, which is intergrated in the housing with the semiconductor microphone.
2. The semiconductor chip package of claim 1 , wherein the housing further includes a sound inlet portion configured to transmit sound from external to the semiconductor chip package to the semiconductor microphone provided within the semiconductor chip package.
3. The semiconductor chip package of claim 1 , wherein the sound generator functions as a membrane.
4. The semiconductor chip package of claim 1 , wherein the sound generator is a piezoelectric layer.
5. The semiconductor chip package of claim 2 , wherein the semiconductor microphone is a microelectromechanical system (MEMS) microphone.
6. The semiconductor chip package of claim 2 , wherein the sound generator, the semiconductor microphone, and the controller are separate devices.
7. A semiconductor chip package, comprising: a controller; a semiconductor microphone; and a housing for at least one semiconductor chip, wherein at least a portion of the housing is configured as a sound generator to generate and transmit sound waves based on electrical signals provided by an integrated circuit of the at least one semiconductor chip, without the sound waves passing through an aperture in the housing, wherein the housing further includes a sound inlet portion configured to transmit sound from external to the semiconductor package to the semiconductor microphone provided within the semiconductor chip package, wherein the sound generator, the semiconductor microphone, and the controller are concomitantly integrated in a single semiconductor chip, which is integrated in the housing.
8. The semiconductor chip package of claim 1 , further comprising: a receiver, wherein the housing comprises the sound generator and the receiver.
9. The semiconductor chip package of claim 1 , further comprising: a receiver comprised within the outer cover portion of the housing.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 23, 2016
October 13, 2020
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