A camera module with reduced light leakage includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. A step is defined at the printed circuit board. The step passes through the first surface and at least one side surface. A flange is defined on the mounting bracket. The flange is received and fixed in the step and this structure places less reliance on the strength and opacity of the particular adhesive used.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A camera module with reduced light leakage comprising: a printed circuit board, the printed circuit board comprising a first surface and at least one side surface perpendicularly connected to the first surface; a step being defined at the printed circuit board, the step formed at an outer edge of the first surface of the printed circuit board and an outer edge of the at least one side surface of the printed circuit board; wherein the printed circuit board comprises a first rigid portion, the first rigid portion comprises a first side surface, a second side surface, and a third side surface; the first side surface is perpendicularly connected to the first surface, the second side surface is perpendicularly connected to the first surface and the first side surface, the third side surface is opposite to the second side surface; the step abuts the first side surface, the second side surface, and the third side surface; a mounting bracket mounted on the printed circuit board, a flange being defined on the mounting bracket; wherein the mounting bracket further comprises a fourth side surface, a fifth side surface, a sixth side surface, and a seventh side surface, the fourth side surface is opposite to the first side surface, the fifth side surface is perpendicularly connected to the fourth side surface, the sixth side surface is opposite to the fourth side surface, the seventh side surface is opposite to the fifth side surface; the flange is located on the peripheral edge of the mounting bracket and abuts the fourth side surface, the fifth side surface, and the sixth side surface; the flange is received and fixed in the step.
2. The camera module with reduced light leakage of claim 1 , wherein the printed circuit board further comprises a second surface opposite to the first surface, the step passes through the second surface.
3. The camera module with reduced light leakage of claim 2 , wherein the flange is received and fixed in the step by an adhesive layer, the step comprises a connecting surface, the connecting surface connects to the first surface, the flange comprises an inwall and a bottom surface perpendicularly connected to the inwall, the inwall faces the connecting surface, the adhesive layer is attached on the connecting surface and the inwall.
4. The camera module with reduced light leakage of claim 1 , wherein the printed circuit board further comprises a second surface opposite to the first surface, the step does not pass through the second surface.
5. The camera module with reduced light leakage of claim 4 , wherein the flange is received and fixed in the step by an adhesive layer, the step comprises a stepping surface and a connecting surface, the stepping surface is parallel to the first surface, the connecting surface connects the stepping surface and the first surface, the flange comprises an inwall and a bottom surface perpendicularly connected to the inwall, the bottom surface faces the stepping surface, the inwall faces the connecting surface, the adhesive layer is attached on the stepping surface, the connecting surface, the inwall, and the bottom surface.
6. The camera module with reduced light leakage of claim 1 , wherein at least one first receiving groove is defined at the mounting bracket, the at least one lens is received in the at least one first receiving groove.
7. The camera module with reduced light leakage of claim 6 , wherein a second receiving groove is defined at the mounting bracket, the second receiving groove is opposite to the first receiving groove and connects to the first receiving groove by an opening.
8. The camera module with reduced light leakage of claim 7 , wherein the camera module with reduced light leakage further comprises an optical filter and a sensor, the optical filter is received in the second receiving groove, the sensor is mounted on the printed circuit board and received in the second receiving groove, and the optical filter is positioned between the lens and the sensor.
9. The camera module with reduced light leakage of claim 1 , wherein the camera module with reduced light leakage further comprises a reinforced adhesive; the reinforced adhesive is mounted on mounting bracket and the printed circuit board.
10. The camera module with reduced light leakage of claim 6 , wherein the printed circuit board further comprises a second rigid portion and a flexible portion, the flexible portion is located between the first rigid portion and the second rigid portion; the step further abuts the flexible portion, the flange further abuts the flexible portion.
11. An electronic device, comprising: a camera module, the camera module comprising: a printed circuit board, the printed circuit board comprising a first surface and at least one side surface perpendicularly connected to the first surface; a step being defined at the printed circuit board, the step formed at an outer edge of the first surface of the printed circuit board and an outer edge of the at least one side surface of the printed circuit board; wherein the printed circuit board comprises a first rigid portion, the first rigid portion comprises a first side surface, a second side surface, and a third side surface; the first side surface is perpendicularly connected to the first surface, the second side surface is perpendicularly connected to the first surface and the first side surface, the third side surface is opposite to the second side surface; the step abuts the first side surface, the second side surface, and the third side surface; a mounting bracket mounted on the printed circuit board, a flange being defined on the mounting bracket; wherein the mounting bracket further comprises a fourth side surface, a fifth side surface, a sixth side surface, and a seventh side surface, the fourth side surface is opposite to the first side surface, the fifth side surface is perpendicularly connected to the fourth side surface, the sixth side surface is opposite to the fourth side surface, the seventh side surface is opposite to the fifth side surface; the flange is located on the peripheral edge of the mounting bracket and abuts the fourth side surface, the fifth side surface, and the sixth side surface; the flange is received and fixed in the step.
12. The electronic device of claim 11 , wherein the printed circuit board further comprises a second surface opposite to the first surface, the step passes through the second surface.
13. The electronic device of claim 12 , wherein the flange is received and fixed in the step by an adhesive layer, the step comprises a connecting surface, the connecting surface connects to the first surface, the flange comprises an inwall and a bottom surface perpendicularly connected to the inwall, the inwall faces the connecting surface, the adhesive layer is attached on the connecting surface and the inwall.
14. The electronic device of claim 11 , wherein the printed circuit board further comprises a second surface opposite to the first surface, the step does not pass through the second surface.
15. The electronic device of claim 14 , wherein the flange is received and fixed in the step by an adhesive layer, the step comprises a stepping surface and a connecting surface, the stepping surface is parallel to the first surface, the connecting surface connects the stepping surface and the first surface, the flange comprises an inwall and a bottom surface perpendicularly connected to the inwall, the bottom surface faces the stepping surface, the inwall faces the connecting surface, the adhesive layer is attached on the stepping surface, the connecting surface, the inwall, and the bottom surface.
16. The electronic device of claim 11 , wherein at least one first receiving groove is defined at the mounting bracket, at least one lens is received in the at least one first receiving groove; a second receiving groove is defined at the mounting bracket, the second receiving groove is opposite to the first receiving groove and connects to the first receiving groove by an opening.
17. The electronic device of claim 16 , wherein the camera module with reduced light leakage further comprises an optical filter and a sensor, the optical filter is received in the second receiving groove, the sensor is mounted on the printed circuit board and received in the second receiving groove, and the optical filter is positioned between the lens and the sensor.
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February 28, 2019
December 8, 2020
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