A magnetic memory device includes a first dielectric layer on a substrate, first and second via plugs in the first dielectric layer, first and second cylindrical memory stacks on the first and second via plugs, respectively, and an insulating cap layer conformally disposed on the first dielectric layer and on sidewalls of the first and second cylindrical memory stacks. The insulating cap layer is not disposed in a logic area and a via forming region between the first and second cylindrical memory stacks.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A magnetic memory device, comprising: a substrate having a memory area and a logic area thereon; a first dielectric layer disposed on the substrate, wherein the first dielectric layer covers the memory area and the logic area; a first via plug disposed in the first dielectric layer; a first cylindrical memory stack disposed on the first via plug, wherein the first cylindrical memory stack comprises a first magnetic tunnel junction (MTJ) element; a second via plug disposed in the first dielectric layer and in proximity to the first via plug; a second cylindrical memory stack disposed on the second via plug, wherein the second cylindrical memory stack comprises a second magnetic tunnel junction (MTJ) element; an insulating cap layer conformally disposed on the first dielectric layer and on sidewalls of the first cylindrical memory stack and the second cylindrical memory stack, wherein the insulating cap layer is not disposed in the logic area and a via forming region between the first cylindrical memory stack and the second cylindrical memory stack, wherein the first dielectric layer has a first minimum thickness in the memory area, a second minimum thickness in the via forming region between the first cylindrical memory stack and the second cylindrical memory stack, wherein the second minimum thickness is smaller than the first minimum thickness.
2. The magnetic memory device according to claim 1 , wherein the first dielectric layer has a third minimum thickness in the logic area, wherein the second minimum thickness is approximately equal to the third minimum thickness, and wherein the second minimum thickness and the third minimum thickness are smaller than the first minimum thickness.
3. The magnetic memory device according to claim 1 further comprising: a second dielectric layer disposed on the substrate and under the first dielectric layer; and an etch stop layer between the first dielectric layer and the second dielectric layer.
4. The magnetic memory device according to claim 1 further comprising: a first spacer disposed on the insulating cap layer and disposed around the first cylindrical memory stack except for the via forming region; and a second spacer disposed on the insulating cap layer and disposed around the second cylindrical memory stack except for the via forming region.
5. The magnetic memory device according to claim 4 , wherein the etch stop layer is a nitrogen-doped silicon carbide layer, the first dielectric layer and the second dielectric layer comprise an ultra-low k material, the insulating cap layer is a silicon nitride layer, and the first spacer and the second spacer are silicon oxide spacers.
6. The magnetic memory device according to claim 5 further comprising a third dielectric layer filled into the via forming region between the first cylindrical memory stack and the second cylindrical memory stack, and wherein the third dielectric layer also covers the logic area, and wherein the third dielectric layer is in direct contact with the first dielectric layer in the logic area and the first dielectric layer in the via forming region.
7. The magnetic memory device according to claim 6 further comprising a lower metal interconnect layer disposed in the second dielectric layer, wherein the lower metal interconnect layer comprises a first metal pad in direct contact with the first via plug, a second metal pad in direct contact with the second via plug, and a first metal line disposed between the first metal pad and the second metal pad.
8. The magnetic memory device according to claim 7 further comprising a first conductive via disposed in the third dielectric layer, the first dielectric layer and the etch stop layer, wherein the first conductive via is in direct contact with the first metal line.
9. The magnetic memory device according to claim 8 further comprising a second metal line disposed in the second dielectric layer within the logic area, and a second conductive via disposed in the third dielectric layer, the first dielectric layer and the etch stop layer, wherein the second conductive via is in direct contact with the second metal line.
10. The magnetic memory device according to claim 9 , wherein the first via plug and the second via plug are tungsten plugs, and wherein the first conductive via and the second conductive via are copper vias.
11. The magnetic memory device according to claim 10 , wherein the first conductive via and the second conductive via have a top surface that is coplanar with a top surface of the third dielectric layer and a top surface of the first cylindrical memory stack and the second cylindrical memory stack.
12. A method for forming a memory device, comprising: providing a substrate having a memory area and a logic area thereon; forming a first dielectric layer on the substrate, wherein the first dielectric layer covers the memory area and the logic area; forming a first via plug and a second via plug in the first dielectric layer in the memory area; forming a first cylindrical memory stack and a second cylindrical memory stack on the first via plug and the second via plug, respectively; conformally depositing an insulating cap layer on the first cylindrical memory stack, the second cylindrical memory stack, and the first dielectric layer; forming an etch mask covering the memory area but exposing the logic area, wherein the etch mask also exposes a via forming region between the first cylindrical memory stack and the second cylindrical memory stack; and etching away the insulating cap layer, and a portion of the first dielectric layer from the via forming region, and the insulating cap layer and a portion of the first dielectric layer from the logic area.
13. The method according to claim 12 further comprising: depositing a spacer layer on the insulating cap layer; and anisotropically etching the spacer layer, thereby forming a first spacer on the insulating cap layer and around the first cylindrical memory stack and a second spacer on the insulating cap layer and around the second cylindrical memory stack.
14. The method according to claim 13 further comprising: etching away a portion of the first spacer and a portion of the second spacer from the via forming region.
15. The method according to claim 12 , wherein the etch mask is a patterned photoresist layer.
16. The method according to claim 12 further comprising: removing the etch mask.
17. The method according to claim 16 further comprising: forming a second dielectric disposed on the substrate and under the first dielectric layer; and forming an etch stop layer between the first dielectric layer and the second dielectric layer.
18. The method according to claim 17 , wherein the etch stop layer is a nitrogen-doped silicon carbide layer, the first dielectric layer and the second dielectric layer comprise an ultra-low k material, the insulating cap layer is a silicon nitride layer, and the spacer layer is a silicon oxide layer.
19. The method according to claim 17 further comprising: forming a third dielectric layer into the via forming region between the first cylindrical memory stack and the second cylindrical memory stack, wherein the third dielectric layer also covers the logic area, and wherein the third dielectric layer is in direct contact with the first dielectric layer in the logic area and is in direct contact with the first dielectric layer in via forming region.
20. The method according to claim 19 further comprising: forming a lower metal interconnect layer in the second dielectric layer, wherein the lower metal interconnect layer comprises a first metal pad in direct contact with the first via plug, a second metal pad in direct contact with the second via plug, and a first metal line disposed between the first metal pad and the second metal pad.
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July 8, 2019
January 26, 2021
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