A method of forming a memory device having magnetic tracks individually comprising a plurality of magnetic domains having domain walls, includes forming an elevationally outer substrate material of uniform chemical composition. The uniform composition material is partially etched into to form alternating regions of elevational depressions and elevational protrusions in the uniform composition material. A plurality of magnetic tracks is formed over and which angle relative to the alternating regions. Interfaces of immediately adjacent of the regions individually form a domain wall pinning site in individual of the magnetic tracks. Other methods, including memory devices independent of method, are disclosed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of forming a memory device comprising magnetic tracks individually comprising a plurality of magnetic domains having domain walls, comprising: forming an elevationally outermost substrate material of uniform chemical composition that has multiple physical differences therein, the multiple physical differences being characterized by one of (a) and (b), where, (a): amorphous regions and crystalline regions; (b): crystalline regions of different lattice configurations; etching only partially elevationally into the material of uniform chemical composition having multiple physical differences therein to form the material of uniform chemical composition having multiple physical differences therein to have alternating regions of elevational depressions and elevational protrusions in a finished construction of the memory device; and forming a plurality of magnetic tracks over and which angle relative to the alternating regions, interfaces of immediately adjacent of the alternating regions individually comprising a domain wall pinning site in individual of the magnetic tracks.
2. The method of claim 1 wherein the alternating regions have outer surfaces which are horizontal or within 10° of horizontal.
3. The method of claim 1 wherein the composition is dielectric.
4. The method of claim 3 wherein the composition comprises at least one of silicon dioxide and silicon nitride.
5. The method of claim 1 wherein magnetic material of the magnetic tracks is not formed directly against the elevationally outermost substrate material.
6. The method of claim 5 comprising an electrically conductive material between the elevationally outermost substrate material and the magnetic tracks.
7. The method of claim 1 wherein magnetic material of the magnetic tracks is not elevationally within the depressions.
8. The method of claim 1 wherein the alternating regions form elongated parallel trenches and mesas.
9. The method of claim 1 comprising (a): amorphous regions and crystalline regions.
10. The method of claim 1 comprising (b): crystalline regions of different lattice configurations.
11. The method of claim 1 wherein the elevationally outermost substrate material has a thickness of from about 30 nanometers to about 1 micron.
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August 31, 2018
February 16, 2021
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